WS128K32-XXX
128Kx32 SRAM MODULE, SMD 5962-93187 & 5962-95595
FEATURES
Access Times of 15, 17, 20, 25, 35, 45, 55ns
MIL-STD-883 Compliant Devices Available
Packaging
Low Power CMOS
TTL Compatible Inputs and Outputs
Built in Decoupling Caps and Multiple Ground Pins for Low
Noise Operation
• 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP
(Package 400)
Weight:
WS128K32-XG2UX - 8 grams typical
WS128K32-XG2LX - 8 grams typical
WS128K32-XH1X - 13 grams typical
WS128K32-XG4TX1 - 20 grams typical
• 68 lead, 40mm CQFP (G4T)1, 3.56mm (0.140") (Package
502)
• 68 lead, 22.4mm CQFP (G2U), 3.56mm (0.140"),
(Package 510)
Devices are upgradeable to 512Kx32
• 68 lead, 22.4mm (0.880") square, CQFP (G2L), 5.08mm
(0.200") high, (Package 528)
Organized as 128Kx32; User Configurable as 256Kx16 or
This product is subject to change without notice.
512Kx8
Commercial, Industrial and Military Temperature Ranges
5 Volt Power Supply
FIGURE 1 – PIN CONFIGURATION FOR WS128K32N-XH1X
Top View
Pin Description
1
12
23
34
45
56
I/O0-31
A0-16
Data Inputs/Outputs
Address Inputs
Write Enables
Chip Selects
I/O8
I/O9
I/O10
A13
WE2#
CS2#
GND
I/O11
A10
I/O15
I/O24
I/O25
I/O26
A6
VCC
CS4#
WE4#
I/O27
A3
I/O31
I/O30
I/O29
I/O28
A0
WE1-4
#
CS1-4
OE#
VCC
#
I/O14
I/O13
I/O12
OE#
NC
Output Enable
Power Supply
Ground
GND
NC
Not Connected
A14
A7
Block Diagram
A15
A11
NC
A4
A1
WE#1 CS#1
WE#2 CS#2
WE#3 CS#3
WE#4 CS#4
128K x 8
A16
A12
WE1#
I/O7
A8
A5
A2
OE#
A0-16
NC
VCC
A9
WE3#
CS3#
GND
I/O19
I/O23
I/O22
I/O21
I/O20
128K x 8
128K x 8
128K x 8
I/O0
I/O1
I/O2
CS1#
NC
I/O6
I/O16
I/O17
I/O18
I/O5
8
8
8
8
I/O3
I/O4
I/O 0-7
I/O 8-15
I/O 16-23
I/O 24-31
11
22
33
44
55
66
Microsemi Corporation reserves the right to change products or specifications without notice.
September 2010 © 2010 Microsemi Corporation. All rights reserved.
Rev. 18
1
Microsemi Corporation • (602) 437-1520 • www.microsemi.com