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WF4M32-150G4TE5 PDF预览

WF4M32-150G4TE5

更新时间: 2024-11-05 20:04:47
品牌 Logo 应用领域
美高森美 - MICROSEMI 内存集成电路
页数 文件大小 规格书
15页 258K
描述
Flash Module, 4MX32, 150ns, CQFP68, 40 MM, 3.50 MM HEIGHT, CERAMIC, LQFP-68

WF4M32-150G4TE5 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:QFP包装说明:40 MM, 3.50 MM HEIGHT, CERAMIC, LQFP-68
针数:68Reach Compliance Code:unknown
ECCN代码:3A991.B.1.AHTS代码:8542.32.00.51
风险等级:5.79最长访问时间:150 ns
其他特性:USER CONFIGURABLE AS 16M X 8备用内存宽度:16
JESD-30 代码:S-CQFP-F68JESD-609代码:e4
长度:39.6 mm内存密度:134217728 bit
内存集成电路类型:FLASH MODULE内存宽度:32
功能数量:1端子数量:68
字数:4194304 words字数代码:4000000
工作模式:ASYNCHRONOUS最高工作温度:100 °C
最低工作温度:-55 °C组织:4MX32
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装代码:QFF
封装形状:SQUARE封装形式:FLATPACK
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
编程电压:5 V认证状态:Not Qualified
座面最大高度:3.56 mm最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V标称供电电压 (Vsup):5 V
表面贴装:YES技术:CMOS
温度等级:OTHER端子面层:GOLD
端子形式:FLAT端子节距:1.27 mm
端子位置:QUAD处于峰值回流温度下的最长时间:NOT SPECIFIED
类型:NOR TYPE宽度:39.6 mm
Base Number Matches:1

WF4M32-150G4TE5 数据手册

 浏览型号WF4M32-150G4TE5的Datasheet PDF文件第2页浏览型号WF4M32-150G4TE5的Datasheet PDF文件第3页浏览型号WF4M32-150G4TE5的Datasheet PDF文件第4页浏览型号WF4M32-150G4TE5的Datasheet PDF文件第5页浏览型号WF4M32-150G4TE5的Datasheet PDF文件第6页浏览型号WF4M32-150G4TE5的Datasheet PDF文件第7页 
WF4M32-XXX5  
White Electronic Designs  
PRELIMINARY*  
4MX32 5V FLASH MODULE  
FEATURES  
!
!
Organized as 4Mx32  
!
Access Times of 100, 120, 150ns  
User configurable as 8Mx16 or 16Mx8 in HIP and  
G4T packages.  
!
Packaging:  
!
Commercial, Industrial, and Extended  
Temperature Ranges  
• 66 pin, PGA Type, 1.385" square, Hermetic  
Ceramic HIP (Package 402).  
• 68 lead, 40mm Low Profile CQFP ( Package  
502 ), 3.5mm (0.140") height.  
!
!
!
5 Volt Read and Write. 5V ± 10% Supply.  
Low Power CMOS  
• 68 lead, Hermetic CQFP (G2T), 22.4mm  
(0.880") square (Package 509) 4.57mm  
(0.180") height. Designed to fit JEDEC 68  
lead 0.990CQFJ footprint (Fig. 3)  
Data Polling and Toggle Bit feature for detection  
of program or erase cycle completion.  
!
!
!
Supports reading or programming data to a  
sector not being erased.  
!
!
Sector Architecture  
RESET pin resets internal state machine to the  
read mode.  
• 32 equal size sectors of 64KBytes per each  
2Mx8 chip  
Built-in Decoupling Caps and Multiple Ground  
Pins for Low Noise Operation, Separate Power  
and Ground Planes to improve noise immunity  
• Any combination of sectors can be erased. Also  
supports full chip erase.  
Minimum 100,000 Write/Erase Cycles Minimum  
*This data sheet describes a product under development, not fully  
characterized, and is subject to change without notice.  
Note:  
For programming information refer to Flash Programming 16M5  
Application Note.  
FIG. 1 PIN CONFIGURATION FOR WF4M32-XH2X5  
PIN DESCRIPTION  
TOP VIEW  
I/O0-31 Data Inputs/Outputs  
1
12  
23  
34  
45  
56  
A0-21  
WE  
Address Inputs  
Write Enables  
Chip Selects  
Output Enable  
Power Supply  
Ground  
I/O  
8
9
RESET  
I/O15  
I/O14  
I/O13  
I/O12  
OE  
I/O24  
I/O25  
I/O26  
V
CC  
I/O31  
I/O30  
I/O29  
I/O28  
CS1-4  
OE  
I/O  
CS  
2
CS4  
I/O10  
GND  
I/O11  
NC  
VCC  
GND  
RESET  
A
A
A
A
A
14  
16  
11  
0
A
7
I/O27  
Reset  
A
A
A
V
10  
A
A
A
12  
21  
13  
A
A
A
4
5
6
A1  
A2  
A3  
9
A
17  
BLOCK DIAGRAM  
15  
CC  
WE  
CS  
CS  
3
CS  
4
1
CS  
2
A
21  
18  
I/O  
I/O  
I/O  
I/O  
7
A
8
A20  
CS  
I/O23  
I/O22  
I/O21  
I/O20  
I/O0  
I/O1  
I/O2  
CS  
1
6
5
4
I/O16  
I/O17  
I/O18  
3
OE  
WE  
A19  
GND  
I/O19  
A
0-20  
RESET  
2M x 8  
2M x 8  
2Mx 8  
2M x 8  
I/O3  
2M x 8  
2M x 8  
2M x 8  
2M x 8  
11  
22  
33  
44  
55  
66  
I/O16-23  
I/O24-31  
I/O0-7  
I/O8-15  
1
White Electronic Designs Corporation • (602) 437-1520 • www.whiteedc.com  
December2003 Rev.5  

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