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WDBR7ULxxxxI

更新时间： 2024-11-22 14:52:23

品牌	Logo	应用领域
TTELEC		/
页数	文件大小	规格书
4页	965K
描述
Ultra low profile power resistor, UL508, solder pads

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Ultra Low Profile Power Resistors

WDBR-UL Series

Features:

•

•

•

•

•

•

•

•

•

Ultra low proﬁle thick-ﬁlm on steel

Up to 7kW peak power

Single ﬁxing heatsink mountable

Ideal for dynamic braking, inrush limit and snubber circuits

Choice of ﬂying lead or solder terminaꢀons

Low inductance design

High isolaꢀon, even aꢂer failsafe overload fusing

RoHS compliant, non-ﬂammable construcꢀon

UL508 cerꢀﬁed—UL ﬁle E238661

All Pb-free parts comply with EU Direcꢀve 2011/65/EU amended by (EU) 2015/863 (RoHS3)

Electrical Data

WDBR1UL

WDBR2UL

WDBR3UL

WDBR5UL

WDBR7UL

Resistance range ⁵

Ω

12, 15, 20, 22, 25, 47, 50, 100, 150

10

Resistance tolerance

Pulse peak power rating ¹

Power rating on heatsink ²

Power rating on fan cooled heatsink ³

TCR

%

kW

1.5

170

660

2

3.5

240

5

7

W

190

740

250

950

260

1410

W

850

ppm/°C

<+600

450

Maximum element temperature

Ambient temperature range (heatsink)

Dielectric withstand ⁴

Inductance

°C

°C

V (dc/ac pk)

µH

-55 to +200

2500

<4

<3

<5

<6

Notes:

1. For details of pulse condiꢀon see Fig. 1 in Performance Data.

2. Mounted on a 0.53°C/W heatsink with no forced air cooling, air temperature 25°C.

3. Mounted on a 0.53°C/W heatsink with 5m/s forced air cooling, air temperature 25°C.

4. Based on 100% producꢀon test, duraꢀon 2s minimum.

5. Other ohmic values upon request

Physical Data

Dimensions in mm and weight without terminations in g

t = substrate thickness.

L

W

t

ØD

a

b

c

d

Wt.

Type

±0.1

±0.1

±0.1 nom

nom

nom

nom

min

nom

d = clearance between

exposed conductor

and exposed steel

substrate.

WDBR1UL 49.3

WDBR2UL 61

WDBR3UL 101.6

WDBR5UL 122

35.9

3.2

4.2

5.5

17.6

19.7

4.2

5.5

2.9

4.5

7.5

7.5

12.6

17.1

50.8

40.6 0.9

70

14.5 24.8 10.1

15.3 27 8.6

5.3

The fixing hole is

centrally located.

70

101.2

181.8

1.5

WDBR7UL 152.4 101.6

39.3 10.7 11.8 10.5

Construcꢀon

Construcꢀon Cross Secꢀon

A high integrity dielectric layer is applied to

a machined stainless-steel substrate. Thick-

ﬁlm conductor and resistor paꢁerns are

printed and ﬁred, then protected with a high

temperature overglaze. The terminaꢀon

pads are ꢀnned with solder and opꢀonal

leads are soldered on.

General Note

BI Technologies IRC Welwyn

TT Electronics reserves the right to make changes in product speciﬁcaꢀon without noꢀce or liability.

All informaꢀon is subject to TT Electronics’ own data and is considered accurate at ꢀme of going to print.

www.ꢁelectronics.com/resistors

05.23

© TT Electronics plc

12 3 4

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