WCMA2008U1B
Electrical Characteristics Over the Operating Range
WCMA2008U1B-70
Param-
eter
Description
Test Conditions
Min.
Typ.[2]
Max.
Unit
V
VOH
Output HIGH Voltage
Output LOW Voltage
Input HIGH Voltage
Input LOW Voltage
Input Leakage Current
IOH = –1.0 mA
VCC = 2.7V
VCC = 2.7V
2.4
VOL
VIH
VIL
IOL = 2.1 mA
0.4
V
2.2
–0.3
–1
VCC + 0.3V
V
0.8
+1
+1
15
V
IIX
GND < V <VCC
mA
mA
mA
I
IOZ
ICC
Output Leakage Current GND < VO < VCC, Output Disabled
–1
VCC Operating Supply
Current
f =fMAX= 1/tRC
f = 1 MHz
VCC = 3.3V
IOUT = 0 mA
CMOS Levels
7
1.5
3
ISB1
Automatic CE
CE1 > VCC – 0.2V or CE2 < 0.2V
2
10
mA
Power-Down Current — VIN > VCC – 0.2V or VIN < 0.2V,
CMOS Inputs
f = fmax (Address and Data Only),
f = 0 (OE,WE)
ISB2
Automatic CE
Power-Down Current— VIN> VCC - 0.2V or VIN <0.2V,
CE1 > VCC – 0.2V or CE2 < 0.2V
CMOS Inputs
f = 0, VCC=3.3V
Capacitance[3]
Parameter
Description
Test Conditions
Max.
Unit
pF
CIN
Input Capacitance
Output Capacitance
TA =25°C, f=1MHz,VCC =Vcc(typ)
6
8
COUT
pF
Thermal Resistance
Description
Test Conditions
Symbol
BGA
Unit
Thermal Resistance[3]
(Junction to Ambient)
Still Air, soldered on a 4.25 x 1.125 inch, 4-layer print-
ed circuit board
QJA
55
°C/W
Thermal Resistance[3]
(Junction to Case)
QJC
16
°C/W
Note:
3. Tested initially and after any design or process changes that may affect these parameters.
3