生命周期: | Active | 包装说明: | BGA, BGA159,10X16,50 |
Reach Compliance Code: | compliant | 风险等级: | 5.8 |
最长访问时间: | 120 ns | 启动块: | BOTTOM/TOP |
命令用户界面: | YES | 通用闪存接口: | YES |
数据轮询: | YES | JESD-30 代码: | R-PBGA-B159 |
内存密度: | 536870912 bit | 内存集成电路类型: | FLASH MODULE |
内存宽度: | 64 | 部门数/规模: | 16,254 |
端子数量: | 159 | 字数: | 8388608 words |
字数代码: | 8000000 | 最高工作温度: | 70 °C |
最低工作温度: | 组织: | 8MX64 | |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | BGA |
封装等效代码: | BGA159,10X16,50 | 封装形状: | RECTANGULAR |
封装形式: | GRID ARRAY | 页面大小: | 8 words |
并行/串行: | PARALLEL | 电源: | 3.3 V |
认证状态: | Not Qualified | 就绪/忙碌: | YES |
部门规模: | 4K,32K | 最大待机电流: | 0.00015 A |
子类别: | Flash Memories | 最大压摆率: | 0.18 mA |
标称供电电压 (Vsup): | 3.3 V | 表面贴装: | YES |
技术: | CMOS | 温度等级: | COMMERCIAL |
端子形式: | BALL | 端子节距: | 1.27 mm |
端子位置: | BOTTOM | 切换位: | YES |
类型: | NOR TYPE | 写保护: | HARDWARE/SOFTWARE |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
W78M64V120SBI | MICROSEMI |
获取价格 |
Flash Module, 8MX64, 120ns, PBGA159 | |
W78M64V90SBM | MICROSEMI |
获取价格 |
Flash Module, 8MX64, 90ns, PBGA159 | |
W78M64V-ESSB | WEDC |
获取价格 |
Flash Module, 8MX64, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 | |
W78M64VP110SBC | MICROSEMI |
获取价格 |
Flash, 8MX64, 110ns, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 | |
W78M64VP110SBI | MICROSEMI |
获取价格 |
Flash, 8MX64, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 | |
W78M64VP110SBM | MICROSEMI |
获取价格 |
Flash, 8MX64, 110ns, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 | |
W78M64VP110SBM | WEDC |
获取价格 |
Flash, 16MX32, 110ns, PBGA156, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 | |
W78M64VP120SBC | MICROSEMI |
获取价格 |
Flash, 8MX64, 120ns, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 | |
W78M64VP120SBI | MICROSEMI |
获取价格 |
Flash, 8MX64, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 | |
W78M64VP120SBM | MICROSEMI |
获取价格 |
Flash, 8MX64, 120ns, PBGA159, 13 X 22 MM, 1.27 MM PITCH, PLASTIC, BGA-159 |