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W28F641B

更新时间： 2024-11-22 08:07:43
品牌 Logo 应用领域
华邦 - WINBOND /
页数 文件大小 规格书
31页 1618K
描述
64MBIT (4MBIT × 16) PAGE MODE DUAL WORK FLASH MEMORY

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中文翻译

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W28F641B 数据手册

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W28F641B/T  
64MBIT (4MBIT × 16)  
PAGE MODE DUAL WORK FLASH MEMORY  
Table of Contents-  
1. GENERAL DESCRIPTION.................................................................................................................. 2  
2. FEATURES ......................................................................................................................................... 2  
3. PIN CONFIGURATION ....................................................................................................................... 3  
4. ELECTRICAL CHARACTERISTICS................................................................................................. 16  
Absolute Maximum Ratings* ............................................................................................................ 16  
Operating Conditions........................................................................................................................ 16  
(1)  
Capacitance .................................................................................................................................. 17  
AC Input/Output Test Conditions...................................................................................................... 17  
DC Characteristics............................................................................................................................ 18  
AC Characteristics - Read-only Operations(1)................................................................................. 20  
(1, 2)  
AC Characteristics - Write Operations  
...................................................................................... 23  
Reset Operations.............................................................................................................................. 25  
Reset AC Specifications................................................................................................................... 25  
(3)  
Block Erase, Full Chip Erase, (Page Buffer) Program and OTP Program Performance ............. 26  
5. ADDITIONAL INFORMATION........................................................................................................... 27  
Recommended Operating Conditions .............................................................................................. 27  
At Device Power-Up ................................................................................................................... 27  
Glitch Noises .............................................................................................................................. 28  
6. ORDERING INFORMATION............................................................................................................. 29  
7. PACKAGE DIMENSIONS ................................................................................................................. 30  
48-pin Standard Thin Small Outline Package (measured in millimeters)......................................... 30  
48-ball TFBGA (8 mm x 11 mm) (measurements in millimeters)..................................................... 30  
8. VERSION HISTORY ......................................................................................................................... 31  
Publication Release Date: March 27, 2003  
- 1 -  
Revision A3  
1234567...31

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