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W19B320ATBAH PDF预览

W19B320ATBAH

更新时间: 2024-10-28 18:30:07
品牌 Logo 应用领域
华邦 - WINBOND 内存集成电路
页数 文件大小 规格书
53页 479K
描述
Flash, 2MX16, 70ns, PBGA48, 6 X 8 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-48

W19B320ATBAH 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:BGA包装说明:6 X 8 MM, 0.80 MM PITCH, LEAD FREE, TFBGA-48
针数:48Reach Compliance Code:unknown
ECCN代码:3A991.B.1.AHTS代码:8542.32.00.51
风险等级:5.29最长访问时间:70 ns
备用内存宽度:8启动块:TOP
JESD-30 代码:R-PBGA-B48JESD-609代码:e1
长度:8 mm内存密度:33554432 bit
内存集成电路类型:FLASH内存宽度:16
功能数量:1端子数量:48
字数:2097152 words字数代码:2000000
工作模式:ASYNCHRONOUS最高工作温度:85 °C
最低工作温度:-20 °C组织:2MX16
封装主体材料:PLASTIC/EPOXY封装代码:TFBGA
封装形状:RECTANGULAR封装形式:GRID ARRAY, THIN PROFILE, FINE PITCH
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
编程电压:3 V认证状态:Not Qualified
座面最大高度:1.2 mm最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):2.7 V标称供电电压 (Vsup):3 V
表面贴装:YES技术:CMOS
温度等级:OTHER端子面层:TIN SILVER COPPER
端子形式:BALL端子节距:0.8 mm
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
类型:NOR TYPE宽度:6 mm
Base Number Matches:1

W19B320ATBAH 数据手册

 浏览型号W19B320ATBAH的Datasheet PDF文件第1页浏览型号W19B320ATBAH的Datasheet PDF文件第3页浏览型号W19B320ATBAH的Datasheet PDF文件第4页浏览型号W19B320ATBAH的Datasheet PDF文件第5页浏览型号W19B320ATBAH的Datasheet PDF文件第6页浏览型号W19B320ATBAH的Datasheet PDF文件第7页 
W19B320AT/B  
6.3.4 DQ2: Toggle Bit II...........................................................................................................17  
6.3.5 Reading Toggle Bits DQ6/DQ2 ......................................................................................17  
6.3.6 DQ5: Exceeded Timing Limits........................................................................................17  
6.3.7 DQ3: Sector Erase Timer ...............................................................................................18  
7.  
TABLE OF OPERATION MODES ............................................................................................ 19  
7.1  
7.2  
7.3  
7.4  
7.5  
Device Bus Operations................................................................................................. 19  
AUTOSELECT Codes (High Voltage Method)............................................................. 19  
Sector Address Table (Top Boot Block) ....................................................................... 20  
Sector Address Table (Bottom Boot Block).................................................................. 22  
CFI Query Identification String...................................................................................... 26  
7.5.1 System Interface String ..................................................................................................26  
7.5.2 Device Geometry Definition............................................................................................27  
7.5.3 Primary Vendor-Specific Extended Query ......................................................................28  
7.5.4 Command Definitions .....................................................................................................29  
7.5.5 Write Operation Status ...................................................................................................30  
7.6  
7.7  
7.8  
7.9  
Temporary Sector Unprotect Algorithm........................................................................ 31  
In-System Sector Protect/Unprotect Algorithms........................................................... 32  
Security Sector Protect Verify....................................................................................... 33  
Program Algorithm........................................................................................................ 33  
7.10 Erase Algorithm ............................................................................................................ 34  
7.11 Data Polling Algorithm .................................................................................................. 34  
7.12 Toggle Bit Algorithm ..................................................................................................... 35  
ELECTRICAL CHARACTERISTICS......................................................................................... 36  
8.  
8.1  
8.2  
8.3  
Absolute Maximum Ratings.......................................................................................... 36  
Operating Ranges......................................................................................................... 36  
DC Characteristics........................................................................................................ 37  
8.3.1 CMOS Compatible..........................................................................................................37  
8.4  
AC Characteristics........................................................................................................ 38  
8.4.1 Test Condition ................................................................................................................38  
8.4.2 AC Test Load and Waveforms .......................................................................................38  
8.5  
8.6  
8.7  
8.8  
8.9  
Read-Only Operations.................................................................................................. 39  
Hardware Reset (#RESET) .......................................................................................... 39  
Word/Byte Configuration (#BYTE)................................................................................ 39  
Erase and Program Operation...................................................................................... 40  
Temporary Sector Unprotect ........................................................................................ 40  
8.10 Alternate #CE Controlled Erase and Program Operations........................................... 41  
TIMING WAVEFORMS............................................................................................................. 42  
9.  
9.1  
AC Read Waveform...................................................................................................... 42  
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