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W19B320ATT9H PDF预览

W19B320ATT9H

更新时间: 2024-11-27 18:30:11
品牌 Logo 应用领域
华邦 - WINBOND 光电二极管内存集成电路
页数 文件大小 规格书
53页 479K
描述
Flash, 2MX16, 70ns, PDSO48, 12 X 20 MM, LEAD FREE, TSOP-48

W19B320ATT9H 技术参数

是否Rohs认证: 符合生命周期:Obsolete
零件包装代码:TSOP包装说明:12 X 20 MM, LEAD FREE, TSOP-48
针数:48Reach Compliance Code:unknown
ECCN代码:3A991.B.1.AHTS代码:8542.32.00.51
风险等级:5.27最长访问时间:70 ns
备用内存宽度:8启动块:TOP
JESD-30 代码:R-PDSO-G48JESD-609代码:e3
长度:18.4 mm内存密度:33554432 bit
内存集成电路类型:FLASH内存宽度:16
湿度敏感等级:3功能数量:1
端子数量:48字数:2097152 words
字数代码:2000000工作模式:ASYNCHRONOUS
最高工作温度:85 °C最低工作温度:-20 °C
组织:2MX16封装主体材料:PLASTIC/EPOXY
封装代码:TSOP1封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE并行/串行:PARALLEL
峰值回流温度(摄氏度):260编程电压:3 V
认证状态:Not Qualified座面最大高度:1.2 mm
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3 V表面贴装:YES
技术:CMOS温度等级:OTHER
端子面层:MATTE TIN端子形式:GULL WING
端子节距:0.5 mm端子位置:DUAL
处于峰值回流温度下的最长时间:40类型:NOR TYPE
宽度:12 mmBase Number Matches:1

W19B320ATT9H 数据手册

 浏览型号W19B320ATT9H的Datasheet PDF文件第2页浏览型号W19B320ATT9H的Datasheet PDF文件第3页浏览型号W19B320ATT9H的Datasheet PDF文件第4页浏览型号W19B320ATT9H的Datasheet PDF文件第5页浏览型号W19B320ATT9H的Datasheet PDF文件第6页浏览型号W19B320ATT9H的Datasheet PDF文件第7页 
W19B320AT/B Data Sheet  
4M × 8/2M × 16 BITS  
3V FLEXIBLE BANK FLASH MEMORY  
Table of Contents-  
1.  
2.  
3.  
4.  
5.  
6.  
GENERAL DESCRIPTION ......................................................................................................... 4  
FEATURES................................................................................................................................. 4  
PIN CONFIGURATIONS ............................................................................................................ 5  
BLOCK DIAGRAM ...................................................................................................................... 6  
PIN DESCRIPTION..................................................................................................................... 6  
FUNCTIONAL DESCRIPTION ................................................................................................... 7  
6.1  
Device Bus Operation..................................................................................................... 7  
6.1.1 Word/Byte Configuration ..................................................................................................7  
6.1.2 Reading Array Data..........................................................................................................7  
6.1.3 Writing Commands/Command Sequences.......................................................................7  
6.1.4 Simultaneous Read/Write Operations with Zero Latency .................................................8  
6.1.5 Standby Mode ..................................................................................................................8  
6.1.6 Automatic Sleep Mode .....................................................................................................8  
6.1.7 #RESET: Hardware Reset Pin..........................................................................................9  
6.1.8 Output Disable Mode........................................................................................................9  
6.1.9 Autoselect Mode...............................................................................................................9  
6.1.10 Sector/Sector Block Protection and Unprotection...........................................................9  
6.1.11 Write Protect (#WP) .....................................................................................................10  
6.1.12 Temporary Sector Unprotect ........................................................................................10  
6.1.13 Security Sector Flash Memory Region .........................................................................10  
6.1.14 Hardware Data Protection ............................................................................................11  
6.2  
Command Definitions ................................................................................................... 12  
6.2.1 Reading Array Data........................................................................................................12  
6.2.2 Reset Command.............................................................................................................12  
6.2.3 AUTOSELECT Command Sequence.............................................................................13  
6.2.4 Byte/Word Program Command Sequence......................................................................13  
6.2.5 Unlock Bypass Command Sequence .............................................................................14  
6.2.6 Chip Erase Command Sequence ...................................................................................14  
6.2.7 Sector Erase Command Sequence ................................................................................14  
6.2.8 Erase Suspend/Erase Resume Commands ...................................................................15  
6.3  
Write Operation Status ................................................................................................. 16  
6.3.1 DQ7: #Data Polling.........................................................................................................16  
6.3.2 RY/#BY: Ready/#Busy ...................................................................................................16  
6.3.3 DQ6: Toggle Bit I............................................................................................................16  
Publication Release Date: December 27, 2005  
- 1 -  
Revision A4  

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