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VSC9295XSM PDF预览

VSC9295XSM

更新时间: 2024-01-18 11:40:07
品牌 Logo 应用领域
VITESSE /
页数 文件大小 规格书
157页 1815K
描述
Telecom IC, PBGA1072,

VSC9295XSM 技术参数

是否Rohs认证: 符合生命周期:Obsolete
Reach Compliance Code:compliantHTS代码:8542.39.00.01
风险等级:5.83JESD-30 代码:S-PBGA-B1072
端子数量:1072封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装等效代码:BGA1072,34X34,50
封装形状:SQUARE封装形式:GRID ARRAY
电源:1.2,1.8/2.5,2.5/3.3 V认证状态:Not Qualified
子类别:Other Telecom ICs最大压摆率:11000 mA
表面贴装:YES端子形式:BALL
端子节距:1.27 mm端子位置:BOTTOM

VSC9295XSM 数据手册

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VSC9295  
Datasheet  
Table 36. Revision ID Register Map .........................................................................................................119  
Table 37. Revision ID Register Map Signals ............................................................................................119  
Table 38. Interrupt Composite States Register Map .................................................................................119  
Table 39. Interrupt Composite States Register Map Signals ....................................................................119  
Table 40. Software Reset Register Map ...................................................................................................120  
Table 41. Software Reset Register Map Signals ......................................................................................120  
Table 42. Software Configuration Command Register Map .....................................................................120  
Table 43. Software Configuration Command Register Map Signals .........................................................121  
Table 44. High-Speed (TFI-5 Data) Signal DC Characteristics ................................................................123  
Table 45. LVCMOS DC Characteristics ....................................................................................................124  
Table 46. Core Power Supply Voltages and Currents ...............................................................................125  
Table 47. CMOS I/O Power Supply Voltages and Currents ......................................................................125  
Table 48. High-Speed Interface Power Supply Voltages and Currents .....................................................125  
Table 49. CPU Interface Timing Variable Definitions ................................................................................129  
Table 50. Overhead Interface Timing Variable Definitions ........................................................................131  
Table 51. High-Speed Interface Receiver Side AC Characteristics ..........................................................131  
Table 52. Receiver Jitter Tolerance Mask Definitions ...............................................................................132  
Table 53. High-Speed Interface Transmitter Side AC Characteristics ......................................................132  
Table 54. Reference Clock Jitter Tolerance ..............................................................................................133  
Table 55. Recommended Operating Conditions ......................................................................................133  
Table 56. Absolute Maximum Ratings ......................................................................................................134  
Table 57. Data Traffic Signals ...................................................................................................................137  
Table 58. CPU Interface Signals ..............................................................................................................137  
Table 59. Frame Synchronization Signals ................................................................................................137  
Table 60. Overhead Monitor Interface Signals .........................................................................................137  
Table 61. JTAG Interface Signals .............................................................................................................138  
Table 62. CMU Signals .............................................................................................................................138  
Table 63. Miscellaneous Signals ..............................................................................................................138  
Table 64. Test Mode Signals ....................................................................................................................139  
Table 65. Core Power ...............................................................................................................................139  
Table 66. CMOS I/O Power ......................................................................................................................139  
Table 67. High-Speed Interface Power .....................................................................................................139  
Table 68. Pins by Number ........................................................................................................................140  
Table 69. Thermal Resistances ................................................................................................................155  
Table 70. Ordering Information ................................................................................................................157  
10 of 157  
VMDS-10144 Revision 4.4  
April 2009  

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