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VSC9295XSM PDF预览

VSC9295XSM

更新时间: 2024-02-17 21:47:43
品牌 Logo 应用领域
VITESSE /
页数 文件大小 规格书
157页 1815K
描述
Telecom IC, PBGA1072,

VSC9295XSM 技术参数

是否Rohs认证: 符合生命周期:Obsolete
Reach Compliance Code:compliantHTS代码:8542.39.00.01
风险等级:5.83JESD-30 代码:S-PBGA-B1072
端子数量:1072封装主体材料:PLASTIC/EPOXY
封装代码:BGA封装等效代码:BGA1072,34X34,50
封装形状:SQUARE封装形式:GRID ARRAY
电源:1.2,1.8/2.5,2.5/3.3 V认证状态:Not Qualified
子类别:Other Telecom ICs最大压摆率:11000 mA
表面贴装:YES端子形式:BALL
端子节距:1.27 mm端子位置:BOTTOM

VSC9295XSM 数据手册

 浏览型号VSC9295XSM的Datasheet PDF文件第151页浏览型号VSC9295XSM的Datasheet PDF文件第152页浏览型号VSC9295XSM的Datasheet PDF文件第153页浏览型号VSC9295XSM的Datasheet PDF文件第154页浏览型号VSC9295XSM的Datasheet PDF文件第155页浏览型号VSC9295XSM的Datasheet PDF文件第156页 
VSC9295  
Datasheet  
7
Ordering Information  
The VSC9295 device is available in two package types. VSC9295SM is a 1072-pin, flip chip ball grid array  
(FCBGA) with a 45 mm × 45 mm body size, 1.27 mm pin pitch, and 3.4 mm maximum height. The device is  
also available in a lead(Pb)-free (second-level interconnect only) package, VSC9295XSM.  
Lead(Pb)-free products from Vitesse comply with the temperatures and profiles defined in the joint IPC and  
JEDEC standard IPC/JEDEC J-STD-020. For more information, see the IPC and JEDEC standard.  
The following table lists the ordering information for the VSC9295 device.  
Table 70. Ordering Information  
Part Order Number  
Description  
1072-pin FCBGA, 45 mm × 45 mm body size, 1.27 mm pin pitch, and 3.4 mm maximum  
height  
VSC9295SM  
Lead(Pb)-free (second-level interconnect only),1072-pin FCBGA, 45 mm × 45 mm body  
size, 1.27 mm pin pitch, and 3.4 mm maximum height  
VSC9295XSM  
CORPORATE HEADQUARTERS  
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Copyright © 2005–2009 by Vitesse Semiconductor Corporation  
PRINTED IN THE U.S.A  
Vitesse Semiconductor Corporation (“Vitesse”) retains the right to make changes to its products or specifications to improve performance, reliability or  
manufacturability. All information in this document, including descriptions of features, functions, performance, technical specifications and availability, is subject to  
change without notice at any time. While the information furnished herein is held to be accurate and reliable, no responsibility will be assumed by Vitesse for its use.  
Furthermore, the information contained herein does not convey to the purchaser of microelectronic devices any license under the patent right of any manufacturer.  
Vitesse products are not intended for use in products or applications, including, but not limited to, medical devices (including life support and implantable medical  
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using a Vitesse product in such an application without express written consent of an officer of Vitesse does so at their own risk, and agrees to fully indemnify Vitesse  
for any damages that may result from such use or sale.  
Safety of Laser Products, IEC 60825. While Vitesse products support IEC 60825, use of Vitesse products does not ensure compliance to IEC 60825. Buyers are  
responsible for ensuring compliance to IEC 60825. Buyers must fully indemnify Vitesse for any damages resulting from non-compliance to IEC 60825.  
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respective holders.  
157 of 157  
VMDS-10144 Revision 4.4  
April 2009  
157  

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