VSC9295
Datasheet
7
Ordering Information
The VSC9295 device is available in two package types. VSC9295SM is a 1072-pin, flip chip ball grid array
(FCBGA) with a 45 mm × 45 mm body size, 1.27 mm pin pitch, and 3.4 mm maximum height. The device is
also available in a lead(Pb)-free (second-level interconnect only) package, VSC9295XSM.
Lead(Pb)-free products from Vitesse comply with the temperatures and profiles defined in the joint IPC and
JEDEC standard IPC/JEDEC J-STD-020. For more information, see the IPC and JEDEC standard.
The following table lists the ordering information for the VSC9295 device.
Table 70. Ordering Information
Part Order Number
Description
1072-pin FCBGA, 45 mm × 45 mm body size, 1.27 mm pin pitch, and 3.4 mm maximum
height
VSC9295SM
Lead(Pb)-free (second-level interconnect only),1072-pin FCBGA, 45 mm × 45 mm body
size, 1.27 mm pin pitch, and 3.4 mm maximum height
VSC9295XSM
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