V8PAL50-M3
Vishay General Semiconductor
www.vishay.com
100
10
1
1000
100
10
Junction to Ambient
TA = 150 °C
TA = 125 °C
TA = 100 °C
TA = 25 °C
0.1
1
0.01
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.1
1
10
100
Instantaneous Forward Voltage (V)
t -Pulse Duration (s)
Fig. 3 - Typical Instantaneous Forward Characteristics
Fig. 6 - Typcial Transient Thermal Impedance
110
100
90
80
70
60
50
40
30
20
100
TA = 150 °C
Epoxy printed circiut
board FR4 copper
thickness = 70μm
TA = 125 °C
TA = 100 °C
10
1
0.1
0.01
TA = 25 °C
S (cm2)
0.001
10
20
30
40
50
60
70
80
90 100
0
1
2
3
4
5
6
7
8
9
Copper Pad Areas (cm2)
Percent of Rated Peak Reverse Voltage (%)
Fig. 4 - Typcial Reverse Leakage Characteristics
Fig. 7 - Thermal Resistance Junction to Ambient vs.
Copper Pad Areas
10 000
TJ = 25 °C
f = 1.0 MHz
V
sig = 50 mVp
-p
1000
100
0.1
1
10
100
Reverse Voltage (V)
Fig. 5 - Typical Junction Capacitance
Revision: 20-Oct-16
Document Number: 87912
3
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