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V62C1161024LL-70T PDF预览

V62C1161024LL-70T

更新时间: 2024-10-13 22:34:19
品牌 Logo 应用领域
MOSEL 内存集成电路静态存储器光电二极管
页数 文件大小 规格书
10页 121K
描述
Ultra Low Power 64K x 16 CMOS SRAM

V62C1161024LL-70T 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:TSOP2包装说明:TSOP2, TSOP44,.46,32
针数:44Reach Compliance Code:unknown
ECCN代码:EAR99HTS代码:8542.32.00.41
风险等级:5.92Is Samacsys:N
最长访问时间:70 nsI/O 类型:COMMON
JESD-30 代码:R-PDSO-G44JESD-609代码:e0
长度:18.41 mm内存密度:1048576 bit
内存集成电路类型:STANDARD SRAM内存宽度:16
功能数量:1端子数量:44
字数:65536 words字数代码:64000
工作模式:ASYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:64KX16
输出特性:3-STATE封装主体材料:PLASTIC/EPOXY
封装代码:TSOP2封装等效代码:TSOP44,.46,32
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE
并行/串行:PARALLEL峰值回流温度(摄氏度):NOT SPECIFIED
电源:2 V认证状态:Not Qualified
座面最大高度:1.2 mm最大待机电流:0.000001 A
最小待机电流:1 V子类别:SRAMs
最大压摆率:0.03 mA最大供电电压 (Vsup):2.2 V
最小供电电压 (Vsup):1.8 V标称供电电压 (Vsup):2 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子面层:Tin/Lead (Sn/Pb)
端子形式:GULL WING端子节距:0.8 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
宽度:10.16 mmBase Number Matches:1

V62C1161024LL-70T 数据手册

 浏览型号V62C1161024LL-70T的Datasheet PDF文件第2页浏览型号V62C1161024LL-70T的Datasheet PDF文件第3页浏览型号V62C1161024LL-70T的Datasheet PDF文件第4页浏览型号V62C1161024LL-70T的Datasheet PDF文件第5页浏览型号V62C1161024LL-70T的Datasheet PDF文件第6页浏览型号V62C1161024LL-70T的Datasheet PDF文件第7页 
V62C1161024L(L)  
Ultra Low Power  
64K x 16 CMOS SRAM  
Features  
Functional Description  
The V62C1161024L is a Low Power CMOS Static RAM  
organized as 65,536 words by 16 bits. Easy memory exp-  
ansion is provided by an active LOW (CE) and (OE) pin.  
• Ultra Low-power consumption  
- Active: 30mA ICC at 70ns  
- Stand-by: 5 mA(CMOS input/output)  
1 mA (CMOS input/output, Lversion)  
This device has an automatic power-down mode feature  
when deselected. Separate Byte Enable controls (BLE  
• 70/85/100/120 ns access time  
• Equal access and cycle time  
• Single +1.8V to 2.2V Power Supply  
• Tri-state output  
and BHE  
) allow individual bytes to be accessed. BLE  
controls the lower bits I/O1 - I/O8. BHE controls the  
upper bits I/O9 - I/O16.  
Writing to these devices is performed by taking Chip  
Enable (CE) with Write Enable (WE) and Byte Enable  
(BLE/BHE) LOW.  
• Automatic power-down when deselected  
Reading from the device is performed by taking Chip  
Enable (CE) with Output Enable (OE) and Byte Enable  
(BLE/BHE) LOW while Write Enable (WE) is held  
HIGH.  
• Multiple center power and ground pins for  
improved noise immunity  
• Individual byte controls for both Read and  
Write cycles  
• Available in 44 pin TSOP (II) Package  
Logic Block Diagram  
TSOP(II)  
Pre-Charge Circuit  
A0  
A1  
A4  
A3  
A2  
A1  
A0  
CE  
I/O1  
I/O2  
I/O3  
I/O4  
Vcc  
Vss  
I/O5  
I/O6  
I/O7  
I/O8  
WE  
1
2
3
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
A5  
A6  
A7  
OE  
Vcc  
Vss  
A2  
A3  
A4  
A5  
A6  
A7  
Memory Array  
1024 X 1024  
BHE  
BLE  
I/O16  
I/O15  
I/O14  
I/O13  
Vss  
Vcc  
I/O12  
I/O11  
I/O10  
I/O9  
NC  
A8  
A9  
Data  
Cont  
I/O1 - I/O8  
I/O Circuit  
Data  
Cont  
I/O9 - I/O16  
Column Select  
A10 A11 A12 A13 A14 A15  
A15  
A14  
A13  
A12  
NC  
A8  
A9  
A10  
A11  
NC  
WE  
OE  
BHE  
BLE  
CE  
1
REV. 1.1 April 2001 V62C1161024L(L)  

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