M C C
US2A
THRU
US2M
TM
ꢀꢁꢂꢃꢄꢅꢆꢄꢇꢇꢈꢃꢂꢁꢉꢊꢅꢆomponents
21201 Itasca Street Chatsworth
ꢆꢋꢅꢌꢍꢎꢍꢍ
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ
$ꢉ%ꢒꢅ ꢅ ꢅ ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ
Micro Commercial Components
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ꢀ
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Features
•
•
Glass Passivated Chip
Super Fast Switching For High Efficiency
Low Forward Voltage Drop And High Current Capability
ꢀ
2 Amp Ultra Fast
Rectifier
50 to 1000 Volts
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•
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•
Low Reverse Leakage Current
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•
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates
Compliant. See ordering information)
·
·
Epoxy meets UL 94 V-0 flammability rating
Moisture Sensitivity Level 1
DO-214AA
(SMB) (LEAD FRAME)
Maximum Ratings
•
•
•
Operating Temperature: -50°C to +150°C
Storage Temperature: -50°C to +150°C
Maximum Thermal Resistance; 20°C/W Junction To Lead
A
Cathode Band
MCC
Catalog
Number
Device
Marking
Maximum
Recurrent
Peak Reverse
Voltage
50V
Maximum
RMS
Voltage
Maximum
DC
Blocking
Voltage
50V
B
US2A
US2B
US2C
US2D
US2G
US2J
US2K
US2M
US2A
US2B
US2C
US2D
US2G
US2J
US2K
US2M
35V
70V
C
100V
150V
100V
150V
105V
140V
280V
420V
560V
700V
200V
400V
200V
400V
F
H
600V
800V
1000V
600V
800V
1000V
D
G
E
Electrical Characteristics @ 25°C Unless Otherwise Specified
DIMENSIONS
Average Forward
Current
IF(AV)
2.0A
TL = 110°C
INCHES
MIN
MM
MIN
DIM
A
MAX
.180
.155
.012
.060
.220
.103
.087
.008
MAX
4.57
3.94
0.31
1..52
5.59
2.62
2.21
0.20
NOTE
Peak Forward Surge
Current
IFSM
50A
8.3ms, half sine
.160
.130
.006
.030
.205
.079
.077
.002
4.06
3.30
0.15
0.76
5.21
2.01
1.96
0.05
B
C
Maximum
Instantaneous
Forward Voltage
D
E
F
G
H
US2A-2D
US2G
US2J-2M
VF
1.0V
1.4V
1.7V
IFM = 2.0A;
TJ = 25°C
SUGGESTED SOLDER
PAD LAYOUT
0.106”
MAX
Maximum DC Reverse
Current At Rated DC
Blocking Voltage
IR
TJ = 25°C
T J = 125°C
5uA
MIN
0.083”
350uA
Maximum Reverse
Recovery Time
US2A-2G
US2J-2M
Trr
CJ
IF=0.5A, IR=1.0A,
Irr=0.25A
50ns
100ns
0.050”
MIN
Typical Junction
Capacitance
28pF
Measured at
1.0MHz, VR=4.0V
*Pulse test: Pulse width 300 µsec, Duty cycle 1%
Note: 1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7.
www.mccsemi.com
1 of 4
Revision: A
2011/01/01