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US2BA-TP-HF PDF预览

US2BA-TP-HF

更新时间: 2024-11-05 13:15:15
品牌 Logo 应用领域
美微科 - MCC /
页数 文件大小 规格书
4页 455K
描述
Rectifier Diode, 1 Phase, 1 Element, 2A, 100V V(RRM), Silicon, DO-214AC, SMA, 2 PIN

US2BA-TP-HF 技术参数

是否Rohs认证: 符合生命周期:Active
包装说明:SMA, 2 PINReach Compliance Code:not_compliant
ECCN代码:EAR99HTS代码:8541.10.00.80
风险等级:5.04应用:EFFICIENCY
配置:SINGLE二极管元件材料:SILICON
二极管类型:RECTIFIER DIODE最大正向电压 (VF):1 V
JEDEC-95代码:DO-214ACJESD-30 代码:R-PDSO-C2
JESD-609代码:e3湿度敏感等级:1
最大非重复峰值正向电流:50 A元件数量:1
相数:1端子数量:2
最高工作温度:150 °C最低工作温度:-50 °C
最大输出电流:2 A封装主体材料:PLASTIC/EPOXY
封装形状:RECTANGULAR封装形式:SMALL OUTLINE
峰值回流温度(摄氏度):260最大重复峰值反向电压:100 V
最大反向电流:5 µA最大反向恢复时间:0.05 µs
表面贴装:YES端子面层:Tin (Sn)
端子形式:C BEND端子位置:DUAL
处于峰值回流温度下的最长时间:10Base Number Matches:1

US2BA-TP-HF 数据手册

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M C C  
US2A  
THRU  
US2M  
TM  
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21201 Itasca Street Chatsworth  
ꢆꢋꢅꢌꢍꢎꢍꢍ  
ꢏꢐꢄꢑꢈꢒꢅꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢎ  
$ꢉ%ꢒꢅ   ꢓꢔꢍꢔ ꢅ!ꢕꢍ"#ꢌꢎꢌ  
Micro Commercial Components  
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ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ  
ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ  
ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ  
Features  
Glass Passivated Chip  
Super Fast Switching For High Efficiency  
Low Forward Voltage Drop And High Current Capability  
2 Amp Ultra Fast  
Rectifier  
50 to 1000 Volts  
ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ  
ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ  
ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ  
Low Reverse Leakage Current  
ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ ꢀ  
Lead Free Finish/Rohs Compliant (Note1) ("P"Suffix designates  
Compliant. See ordering information)  
·
·
Epoxy meets UL 94 V-0 flammability rating  
Moisture Sensitivity Level 1  
DO-214AA  
(SMB) (LEAD FRAME)  
Maximum Ratings  
Operating Temperature: -50°C to +150°C  
Storage Temperature: -50°C to +150°C  
Maximum Thermal Resistance; 20°C/W Junction To Lead  
A
Cathode Band  
MCC  
Catalog  
Number  
Device  
Marking  
Maximum  
Recurrent  
Peak Reverse  
Voltage  
50V  
Maximum  
RMS  
Voltage  
Maximum  
DC  
Blocking  
Voltage  
50V  
B
US2A  
US2B  
US2C  
US2D  
US2G  
US2J  
US2K  
US2M  
US2A  
US2B  
US2C  
US2D  
US2G  
US2J  
US2K  
US2M  
35V  
70V  
C
100V  
150V  
100V  
150V  
105V  
140V  
280V  
420V  
560V  
700V  
200V  
400V  
200V  
400V  
F
H
600V  
800V  
1000V  
600V  
800V  
1000V  
D
G
E
Electrical Characteristics @ 25°C Unless Otherwise Specified  
DIMENSIONS  
Average Forward  
Current  
IF(AV)  
2.0A  
TL = 110°C  
INCHES  
MIN  
MM  
MIN  
DIM  
A
MAX  
.180  
.155  
.012  
.060  
.220  
.103  
.087  
.008  
MAX  
4.57  
3.94  
0.31  
1..52  
5.59  
2.62  
2.21  
0.20  
NOTE  
Peak Forward Surge  
Current  
IFSM  
50A  
8.3ms, half sine  
.160  
.130  
.006  
.030  
.205  
.079  
.077  
.002  
4.06  
3.30  
0.15  
0.76  
5.21  
2.01  
1.96  
0.05  
B
C
Maximum  
Instantaneous  
Forward Voltage  
D
E
F
G
H
US2A-2D  
US2G  
US2J-2M  
VF  
1.0V  
1.4V  
1.7V  
IFM = 2.0A;  
TJ = 25°C  
SUGGESTED SOLDER  
PAD LAYOUT  
0.106”  
MAX  
Maximum DC Reverse  
Current At Rated DC  
Blocking Voltage  
IR  
TJ = 25°C  
T J = 125°C  
5uA  
MIN  
0.083”  
350uA  
Maximum Reverse  
Recovery Time  
US2A-2G  
US2J-2M  
Trr  
CJ  
IF=0.5A, IR=1.0A,  
Irr=0.25A  
50ns  
100ns  
0.050”  
MIN  
Typical Junction  
Capacitance  
28pF  
Measured at  
1.0MHz, VR=4.0V  
*Pulse test: Pulse width 300 µsec, Duty cycle 1%  
Note: 1. High Temperature Solder Exemptions Applied, see EU Directive Annex 7.  
www.mccsemi.com  
1 of 4  
Revision: A  
2011/01/01  

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