US2ABF THRU US2MBF
.0A SURFACE MOUNT ULTRA-FAST RECTIFIER
星合 子
XINGHE ELECTRONICS
2
SMBF
Features
Cathode Band
Top View
ꢁ
ꢁ
ꢁ
ꢁ
Glass Passivated Die Construction
Diffused Junction
Ultra-Fast Recovery Time for High Efficiency
Low Forward Voltage Drop, High Current
Capability, and Low Power Loss
0.145(3.70)
0.137(3.50)
0.087(2.20)
0.075(1.90)
0.174(4.40)
0.166(4.20)
ꢁ
ꢁ
ꢁ
Surge Overload Rating to 30A Peak
Ideally Suited for Automated Assembly
Plastic Material: UL Flammability
Classification Rating 94V-0
0.012(0.30)
0.006(0.15)
0.055(1.40)
0.043(1.10)
0.047(1.20)
0.028(0.70)
MECHANICAL DATA
• Case: SMBF
0.217(5.50)
0.201(5.10)
• Terminals: Solderable per MIL-STD-750, Method 2026
• Approx. Weight: 57mg / 0.002oz
Dimensions in inches and (millimeters)
TA = 25ꢀC unless otherwise specified
Maximum Ratings and Electrical Characteristics
Single phase, half wave, 60Hz, resistive or inductive load.
US2ABF US2BBF US2DBF US2GBF US2JBF US2KBF US2MBF
Symbol
U n it
Characteristics
Maximum Recurrent Peak Reverse Voltage
Maximum RMS Voltage
600
420
600
1000
700
VRRM
VRMS
VDC
50
35
50
100
70
200
140
200
400
280
400
800
560
800
V
Maximum DC Blocking Voltage
Maximum Average Forward
1000
100
A
A
V
IF(AV)
2.0
50
Rectified Current @T =75 C
T
Peak Forward Surge Current,
8.3 ms Single Half Sine-Wave
IFSM
Superimposed on Rated Load (JEDEC Method)
Maximum Instantaneous At 2.0A DC
VF
IR
1.0
1.70
1.30
Maximum DC Reverse Current @T =25 C
A
5.0
uA
At Rated DC Blocking Voltage @T =100 C
A
350
ns
50
Maximun Reverse Recocery Time(Note1)
Typical Junction Capacitance (Note 2)
Typical Thermal Resistance (Note 3)
Operating Temperature Range
100
Trr
P
F
C
J
25
25
R
J T
C/W
C
-55 to+150
-55 to+150
T
J
Storage Temperature Range
TSTG
C
I
NOTES:1.Reverse Recovery Test Conditions: F=0.5A, R=1.0A,
I
IRR
=0.25A.
2.Measured at 1.0MHz applied reverse voltage of 4.0V DC.
3.Unit Mounted on PC board with 5.0 mm2(0.03mm thick) land areas.
1
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