DATA SHEET
GaAs INTEGRATED CIRCUIT
µPG2137T5A
L-BAND PA DRIVER AMPLIFIER
DESCRIPTION
The µPG2137T5A is GaAs MMIC for PA driver amplifier which were developed for mobile phone and another L-
band application.
This device is housed in a 16-pin TSON (Thin small out-line non-leaded) package. And this package is able to
high-density surface mounting.
FEATURES
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Operation frequency
Supply voltage
Circuit current
Power gain
: fopt1 = 893 to 960 MHz (0.8 GHz Band side)
: fopt2 = 1 429 to 1 453 MHz (1.5 GHz Band side)
: VDD1, 3 = 2.55 to 2.85 V (2.7 V TYP.)
: VDD2, 4 = 3.0 to 4.3 V (3.2 V TYP.)
: IDD1 = 28 mA TYP. @ VDD1 = 2.7 V, VDD2 = 3.2 V, VAGC = 2.5 V (0.8 GHz Band side)
: IDD2 = 33 mA TYP. @ VDD3 = 2.7 V, VDD4 = 3.2 V, VAGC = 2.5 V (1.5 GHz Band side)
: GP1 = 27 dB TYP. @ VDD1 = 2.7 V, VDD2 = 3.2 V, VAGC = 2.5 V (0.8 GHz Band side)
GP2 = −13 dB TYP. @ VDD1 = 2.7 V, VDD2 = 3.2 V, VAGC = 0.5 V (0.8 GHz Band side)
GP3 = 30 dB TYP. @ VDD3 = 2.7 V, VDD4 = 3.2 V, VAGC = 2.5 V (1.5 GHz Band side)
GP4 = −10 dB TYP. @ VDD3 = 2.7 V, VDD4 = 3.2 V, VAGC = 0.5 V (1.5 GHz Band side)
: Padj1, 3 = −60 dBc TYP. @ VDD1, 3 = 2.7 V, VDD2, 4 = 3.2 V, VAGC = 2.5 V, Pout = +11 dBm,
∆f = ±50 kHz, 21 kHz Bandwidth (0.8/1.5 GHz Band side)
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Low distortion
High-density surface mounting : 16-pin TSON package (3.3 × 2.3 × 0.6 mm)
APPLICATION
Digital Cellular: PDC 0.8/1.5 GHz Dual Band etc.
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ORDERING INFORMATION
Part Number
Package
Marking
2137
Supplying Form
• Embossed tape 12 mm wide
µPG2137T5A-E1 16-pin TSON
• Pin 8, 9 face the perforation side of the tape
• Qty 3 kpcs/reel
Remark To order evaluation samples, contact your nearby sales office.
Part number for sample order: µPG2137T5A
Caution Observe precautions when handling because these devices are sensitive to electrostatic discharge.
The information in this document is subject to change without notice. Before using this document, please confirm that
this is the latest version.
Not all devices/types available in every country. Please check with local NEC Compound Semiconductor Devices
representative for availability and additional information.
Document No. PG10340EJ01V0DS (1st edition)
Date Published March 2003 CP(K)
Printed in Japan
NEC Compound Semiconductor Devices 2003