UPG2134TB

更新时间： 2024-02-28 16:22:45

品牌	Logo	应用领域
日电电子 - NEC		放大器驱动
页数	文件大小	规格书
9页	58K
描述
L-BAND PA DRIVER AMPLIFIER

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UPG2134TB 数据手册

µPG2134TB

RECOMMENDED SOLDERING CONDITIONS

This product should be soldered and mounted under the following recommended conditions. For soldering

methods and conditions other than those recommended below, contact your nearby sales office.

Soldering Method

Infrared Reflow

Soldering Conditions

Condition Symbol

IR260

Peak temperature (package surface temperature)

Time at peak temperature

: 260°C or below

: 10 seconds or less

: 60 seconds or less

: 120±30 seconds

: 3 times

Time at temperature of 220°C or higher

Preheating time at 120 to 180°C

Maximum number of reflow processes

Maximum chlorine content of rosin flux (% mass)

: 0.2%(Wt.) or below

VPS

Peak temperature (package surface temperature)

Time at temperature of 200°C or higher

Preheating time at 120 to 150°C

: 215°C or below

: 25 to 40 seconds

: 30 to 60 seconds

: 3 times

VP215

WS260

HS350

Maximum number of reflow processes

Maximum chlorine content of rosin flux (% mass)

: 0.2%(Wt.) or below

Wave Soldering

Partial Heating

Peak temperature (molten solder temperature)

Time at peak temperature

: 260°C or below

: 10 seconds or less

Preheating temperature (package surface temperature) : 120°C or below

Maximum number of flow processes

: 1 time

Maximum chlorine content of rosin flux (% mass)

: 0.2%(Wt.) or below

Peak temperature (pin temperature)

: 350°C or below

Soldering time (per side of device)

: 3 seconds or less

: 0.2%(Wt.) or below

Maximum chlorine content of rosin flux (% mass)

Caution Do not use different soldering methods together (except for partial heating).

Data Sheet PG10194EJ01V0DS

1...5 6 789

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