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UPD4481362GF-A60-A PDF预览

UPD4481362GF-A60-A

更新时间: 2024-11-20 14:45:27
品牌 Logo 应用领域
瑞萨 - RENESAS 静态存储器
页数 文件大小 规格书
28页 220K
描述
IC,SYNC SRAM,256KX36,CMOS,QFP,100PIN,PLASTIC

UPD4481362GF-A60-A 技术参数

是否Rohs认证: 符合生命周期:Obsolete
Reach Compliance Code:unknown风险等级:5.84
Base Number Matches:1

UPD4481362GF-A60-A 数据手册

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DATA SHEET  
MOS INTEGRATED CIRCUIT  
μ
PD4481162, 4481182, 4481322, 4481362  
8M-BIT ZEROSBTM SRAM  
PIPELINED OPERATION  
Description  
The μPD4481162 is a 524,288-word by 16-bit, the μPD4481182 is a 524,288-word by 18-bit, the μPD4481322 is a  
262,144-word by 32-bit and the μPD4481362 is a 262,144-word by 36-bit ZEROSB static RAM fabricated with  
advanced CMOS technology using full CMOS six-transistor memory cell.  
The μPD4481162, μPD4481182, μPD4481322 and μPD4481362 are optimized to eliminate dead cycles for read to  
write, or write to read transitions. These ZEROSB static RAMs integrate unique synchronous peripheral circuitry, 2-bit  
burst counter and output buffer as well as SRAM core. All input registers are controlled by a positive edge of the  
single clock input (CLK).  
The μPD4481162, μPD4481182, μPD4481322 and μPD4481362 are suitable for applications which require  
synchronous operation, high speed, low voltage, high density and wide bit configuration, such as buffer memory.  
ZZ has to be set LOW at the normal operation. When ZZ is set HIGH, the SRAM enters Power Down State (“Sleep”).  
In the “Sleep” state, the SRAM internal state is preserved. When ZZ is set LOW again, the SRAM resumes normal  
operation.  
The μPD4481162, μPD4481182, μPD4481322 and μPD4481362 are packaged in 100-pin PLASTIC LQFP with a 1.4  
mm package thickness for high density and low capacitive loading.  
Features  
Low voltage core supply : VDD = 3.3 ± 0.165 V (-A44, -A50, -A60, -A75, -A44Y, -A50Y, -A60Y, -A75Y)  
VDD = 2.5 ± 0.125 V (-C60, -C75, -C60Y, -C75Y)  
Synchronous operation  
Operating temperature : TA = 0 to 70 °C (-A44, -A50, -A60, -A75, -C60, -C75)  
TA = 40 to +85 °C (-A44Y, -A50Y, -A60Y, -A75Y, -C60Y, -C75Y)  
100 percent bus utilization  
Internally self-timed write control  
Burst read / write : Interleaved burst and linear burst sequence  
Fully registered inputs and outputs for pipelined operation  
All registers triggered off positive clock edge  
3.3V or 2.5V LVTTL Compatible : All inputs and outputs  
Fast clock access time : 2.8 ns (225 MHz), 3.2 ns (200 MHz), 3.5 ns (167 MHz) , 4.2 ns (133 MHz)  
Asynchronous output enable : /G  
Burst sequence selectable : MODE  
Sleep mode : ZZ (ZZ = Open or Low : Normal operation)  
Separate byte write enable : /BW1 to /BW4 (μPD4481322 and μPD4481362)  
/BW1 and /BW2 (μPD4481162 and μPD4481182)  
Three chip enables for easy depth expansion  
Common I/O using three state outputs  
The information in this document is subject to change without notice. Before using this document, please  
confirm that this is the latest version.  
Not all products and/or types are available in every country. Please check with an NEC Electronics  
sales representative for availability and additional information.  
Document No. M15562EJ4V0DS00 (4th edition)  
Date Published February 2006 NS CP(K)  
The mark <R> shows major revised points.  
Printed in Japan  
The revised points can be easily searched by copying an "<R>" in the PDF file and specifying it in the "Find what:" field.  

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