生命周期: | Transferred | 零件包装代码: | BGA |
包装说明: | BGA, | 针数: | 272 |
Reach Compliance Code: | unknown | ECCN代码: | 3A001.A.3 |
HTS代码: | 8542.31.00.01 | 风险等级: | 5.61 |
地址总线宽度: | 64 | 位大小: | 64 |
边界扫描: | YES | 最大时钟频率: | 133 MHz |
外部数据总线宽度: | 64 | 格式: | FLOATING POINT |
集成缓存: | YES | JESD-30 代码: | S-PBGA-B272 |
JESD-609代码: | e1 | 长度: | 29 mm |
低功率模式: | YES | 端子数量: | 272 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | BGA |
封装形状: | SQUARE | 封装形式: | GRID ARRAY |
峰值回流温度(摄氏度): | 260 | 认证状态: | Not Qualified |
座面最大高度: | 2.05 mm | 速度: | 300 MHz |
最大供电电压: | 1.575 V | 最小供电电压: | 1.425 V |
标称供电电压: | 1.5 V | 表面贴装: | YES |
技术: | MOS | 端子面层: | TIN SILVER COPPER |
端子形式: | BALL | 端子节距: | 1.27 mm |
端子位置: | BOTTOM | 处于峰值回流温度下的最长时间: | 10 |
宽度: | 29 mm | uPs/uCs/外围集成电路类型: | MICROPROCESSOR, RISC |
Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
UPD30550AF2-400-NN1 | NEC |
获取价格 |
RISC Microprocessor, 64-Bit, 400MHz, MOS, PBGA272, 29 X 29 MM, PLASTIC, BGA-272 | |
UPD30550AF2-400-NN1-A | NEC |
获取价格 |
RISC Microprocessor, 64-Bit, 400MHz, MOS, PBGA272, 29 X 29 MM, LEAD FREE, CAVITY DOWN, PLA | |
UPD30550AF2-400-NN1-A | RENESAS |
获取价格 |
UPD30550AF2-400-NN1-A | |
UPD30550AF2-600-NN1 | RENESAS |
获取价格 |
暂无描述 | |
UPD30550AF2-800-NN1 | RENESAS |
获取价格 |
UPD30550AF2-800-NN1 | |
UPD30550AGD-300-WML | NEC |
获取价格 |
RISC Microprocessor, 64-Bit, 300MHz, MOS, PQFP208, 28 X 28 MM, FINE PITCH, PLASTIC, QFP-20 | |
UPD30550AGD-300-WML-A | RENESAS |
获取价格 |
64-BIT, 300MHz, RISC PROCESSOR, PQFP208, 28 X 28 MM, LEAD FREE, FINE PITCH, PLASTIC, QFP-2 | |
UPD30550AGD-300-WML-A | NEC |
获取价格 |
RISC Microprocessor, 64-Bit, 300MHz, MOS, PQFP208, 28 X 28 MM, LEAD FREE, FINE PITCH, PLAS | |
UPD30550AGD-350-WML | NEC |
获取价格 |
RISC Microprocessor, 64-Bit, 350MHz, MOS, PQFP208, 28 X 28 MM, FINE PITCH, PLASTIC, QFP-20 | |
UPD30550AGD-350-WML-A | NEC |
获取价格 |
RISC Microprocessor, 64-Bit, 350MHz, MOS, PQFP208, 28 X 28 MM, LEAD FREE, FINE PITCH, PLAS |