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UCC37324DG4 PDF预览

UCC37324DG4

更新时间: 2024-11-20 12:01:43
品牌 Logo 应用领域
德州仪器 - TI 驱动器MOSFET驱动器驱动程序和接口接口集成电路光电二极管信息通信管理
页数 文件大小 规格书
28页 1152K
描述
Dual 4-A Peak High-Speed Low-Side Power-MOSFET Drivers

UCC37324DG4 技术参数

是否无铅:不含铅是否Rohs认证:符合
生命周期:Active零件包装代码:SOIC
包装说明:SOIC-8针数:8
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01Factory Lead Time:6 weeks
风险等级:5.15Is Samacsys:N
高边驱动器:NO输入特性:STANDARD
接口集成电路类型:BUFFER OR INVERTER BASED MOSFET DRIVERJESD-30 代码:R-PDSO-G8
JESD-609代码:e4长度:4.9 mm
湿度敏感等级:1功能数量:2
端子数量:8最高工作温度:70 °C
最低工作温度:最大输出电流:4 A
标称输出峰值电流:4 A输出极性:TRUE
封装主体材料:PLASTIC/EPOXY封装代码:SOP
封装等效代码:SOP8,.25封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
电源:4.5/15 V认证状态:Not Qualified
座面最大高度:1.75 mm子类别:MOSFET Drivers
最大压摆率:0.75 mA最大供电电压:15 V
最小供电电压:4.5 V标称供电电压:14 V
表面贴装:YES技术:BICMOS
温度等级:COMMERCIAL端子面层:Nickel/Palladium/Gold (Ni/Pd/Au)
端子形式:GULL WING端子节距:1.27 mm
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
断开时间:0.05 µs接通时间:0.04 µs
宽度:3.9 mmBase Number Matches:1

UCC37324DG4 数据手册

 浏览型号UCC37324DG4的Datasheet PDF文件第2页浏览型号UCC37324DG4的Datasheet PDF文件第3页浏览型号UCC37324DG4的Datasheet PDF文件第4页浏览型号UCC37324DG4的Datasheet PDF文件第5页浏览型号UCC37324DG4的Datasheet PDF文件第6页浏览型号UCC37324DG4的Datasheet PDF文件第7页 
UCC27323, UCC27324, UCC27325  
UCC37323, UCC37324, UCC37325  
www.ti.com  
SLUS492H JUNE 2001REVISED MAY 2013  
Dual 4-A Peak High-Speed Low-Side Power-MOSFET Drivers  
Check for Samples: UCC27323, UCC27324, UCC27325, UCC37323, UCC37324, UCC37325  
1
FEATURES  
APPLICATIONS  
2
Industry-Standard Pin-Out  
Switch-Mode Power Supplies  
DC/DC Converters  
High Current-Drive Capability of ±4 A at the  
Miller Plateau Region  
Motor Controllers  
Efficient Constant-Current Sourcing Even at  
Low Supply Voltages  
Line Drivers  
Class D Switching Amplifiers  
TTL/CMOS Compatible Inputs Independent of  
Supply Voltage  
DESCRIPTION  
20-ns Typical Rise and 15-ns Typical Fall  
Times with 1.8-nF Load  
The UCC37323/4/5 family of high-speed dual-  
MOSFET drivers deliver large peak currents into  
capacitive loads. Three standard logic options are  
offered — dual-inverting, dual-noninverting, and one-  
inverting and one-noninverting driver. The thermally  
enhanced 8-pin PowerPAD MSOP package (DGN)  
drastically lowers the thermal resistance to improve  
long-term reliability. UCC3732x is also offered in the  
standard SOIC-8 (D) or PDIP-8 (P) packages.  
Typical Propagation-Delay Times of 25 ns with  
Input Falling and 35 ns with Input Rising  
4.5-V to 15-V Supply Voltage  
Supply Current of 0.3 mA  
Dual Outputs are Paralleled for Higher Drive  
Current  
Using a design that inherently minimizes shoot-  
through current, these drivers deliver 4-A of current  
where it is needed most at the Miller plateau region  
during the MOSFET switching transition. A unique  
BiPolar and MOSFET hybrid output stage in parallel  
also allows efficient current sourcing and sinking at  
low supply voltages.  
Available in Thermally Enhanced MSOP  
PowerPAD™ Package with 4.7°C/W θJC  
Rated From –40°C to +125°C  
TrueDrive™ Output Architecture Using Bipolar  
and CMOS Transistors in Parallel  
BLOCK DIAGRAM  
INVERTING  
N/C  
1
8
N/C  
7
6
OUTA  
VDD  
INA  
2
3
NON-INVERTING  
GND  
INVERTING  
5
OUTB  
INB  
4
NON-INVERTING  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
PowerPAD, TrueDrive are trademarks of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2001–2013, Texas Instruments Incorporated  

UCC37324DG4 替代型号

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UCC27424DR TI

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