UCC14131-Q1
ZHCSRY3 –APRIL 2023
www.ti.com.cn
6 Pin Configuration and Functions
GNDP
GNDP
PG
1
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
21
20
19
VEE
2
VEEA
FBVDD
FBVEE
RLIM
VEE
3
ENA
4
GNDP
VIN
5
6
VIN
7
VEE
GNDP
GNDP
GNDP
GNDP
GNDP
GNDP
GNDP
GNDP
GNDP
GNDP
GNDP
8
VDD
VDD
VEE
9
10
11
12
13
14
15
16
17
18
VEE
VEE
VEE
VEE
VEE
VEE
VEE
VEE
图6-1. DWN Package, 36-Pin SSOP (Top View)
表6-1. Pin Functions
PIN
TYPE (1)
DESCRIPTION
NAME
GNDP
NO.
1, 2, 5, 8, 9, 10,
11, 12, 13, 14,
15, 16, 17, 18
Primary-side ground connection for VIN. PIN 1,2, and 5 are analog ground. PIN 8, 9, 10, 11, 12,
13, 14, 15, 16, 17, and 18 are power ground. Place several vias to copper pours for thermal relief.
See Layout Guidelines.
G
Active low power-good open-drain output pin. PG remains low when (VVIN_UVLOP ≤VVIN
≤
PG
3
O
VVIN_OVLO); (VVDD_UVP ≤VFBVDD ≤VVDD_OVP); (VVEE_UVP ≤VFBVEE ≤VVEE_OVP); TJ_Primary
TSHUTPPRIMARY_RISE; and TJ_secondary ≤TSHUTSECONDARY_RISE
≤
Enable pin. Forcing ENA LOW disables the device. Pull HIGH to enable normal device
functionality. 5.5-V recommended maximum.
ENA
VIN
4
I
Primary input voltage. PIN 6 is for analog input, and PIN 7 is for power input. For PIN 7, connect
two 10-µF ceramic capacitor from power VIN PIN 7 to power GNDP PIN 8. Connect a 0.1-µF high-
frequency bypass ceramic capacitor close to PIN 7 and PIN 8.
6, 7
P
19, 20, 21, 22,
23, 24, 25,26,
27, 30,31, 36
Secondary-side reference connection for VDD and COM. The VEE pins are used for the high
current return paths.
VEE
G
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Product Folder Links: UCC14131-Q1
English Data Sheet: SLUSF12