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UC1709DW PDF预览

UC1709DW

更新时间: 2024-01-26 22:41:57
品牌 Logo 应用领域
德州仪器 - TI 驱动器
页数 文件大小 规格书
5页 181K
描述
1.5A 2 CHANNEL, BUF OR INV BASED MOSFET DRIVER, PDSO16, SOIC-16

UC1709DW 技术参数

生命周期:Obsolete零件包装代码:QLCC
包装说明:QCCJ,针数:20
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.82
高边驱动器:YES接口集成电路类型:BUFFER OR INVERTER BASED MOSFET DRIVER
JESD-30 代码:S-PQCC-J20长度:8.965 mm
功能数量:2端子数量:20
最高工作温度:125 °C最低工作温度:-55 °C
标称输出峰值电流:1.5 A封装主体材料:PLASTIC/EPOXY
封装代码:QCCJ封装形状:SQUARE
封装形式:CHIP CARRIER认证状态:Not Qualified
座面最大高度:4.57 mm最大供电电压:40 V
最小供电电压:5 V标称供电电压:20 V
表面贴装:YES技术:BIPOLAR
温度等级:MILITARY端子形式:J BEND
端子节距:1.27 mm端子位置:QUAD
断开时间:0.04 µs接通时间:0.04 µs
宽度:8.965 mm

UC1709DW 数据手册

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UC1709, UC2709, UC3709  
DUAL HIGH-SPEED FET DRIVER  
SLUS196A -- NOVEMBER 1996 -- REVISED MARCH 2000  
D
D
D
D
D
D
1.5 Amp Source/Sink Drive  
Pin Compatible with 0026 Products  
40 ns Rise and Fall into 1000pF  
Low Quiescent Current  
5 V to 40 V Operation  
Thermal Protection  
simplified schematic (only one driver shown)  
V
CC  
5 VOLT  
REGULATOR  
THERMAL  
SENSE  
description  
The UC3709 family of power drivers is an  
effective low-cost solution to the problem of  
providing fast turn-on and off for the  
capacitive gates of power MOSFETs. Made  
with a high-speed Schottky process, these  
devices will provide up to 1.5 A of either  
source or sink current from a totem--pole  
output stage configured for minimal  
cross-conduction current spike.  
INPUT  
A OR B  
6 k  
INPUT  
A OR B  
5.6 V  
The UC3709 is pin compatible with the  
MMH0026 or DS0026, and while the delay  
times are longer, the supply current is much  
less than these older devices.  
GND  
UDG--00068  
With inverting logic, these units feature complete TTL compatibility at the inputs with an output stage that can  
swing over 30 V. This design also includes thermal shutdown protection.  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)}  
N--Pkg  
J--Pkg  
Supply Voltage, V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 V . . . . . . . . . . . . . . . . . . . . . . . 40V  
CC  
Output Current (Source or Sink)  
Steady--State . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±500 mA . . . . . . . . . . . . . . . . . . . ±500 mA  
Peak Transient . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±1.5 A . . . . . . . . . . . . . . . . . . . . . ±1.0 A  
Capacitive Discharge Energy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mJ . . . . . . . . . . . . . . . . . . . . . . 15 mJ  
Digital Inputs} . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5 V . . . . . . . . . . . . . . . . . . . . . . 5.5 V  
Power Dissipation at T = 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 W . . . . . . . . . . . . . . . . . . . . . . . 1 W  
A
Power Dissipation at T = 25°C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 W . . . . . . . . . . . . . . . . . . . . . . . 2 W  
C
Operating Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . --55°C to 125°C . . . . . . . . . . . . . --55°C to 125°C  
Storage Temperature Range . . . . . . . . . . . . . . . . . . . . . . . . . . --65°C to 150°C . . . . . . . . . . . . . --65°C to 150°C  
Lead Temperature (Soldering, 10 Seconds) . . . . . . . . . . . . . . . . . . . . . . 300°C . . . . . . . . . . . . . . . . . . . . . 300 °C  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
All currents are positive into and negative out of the specified terminals. Digital drive can exceed 5.5V if input is limited to 10A. Consult the  
Packaging Section of the Databook for thermal limitations and considerations of the package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright ã 2000, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 · DALLAS, TEXAS 75265  

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