Datasheet > TSMG2700-GS08

TSMG2700-GS08

更新时间： 2024-02-09 09:31:13

品牌	Logo	应用领域
威世 - VISHAY		半导体
页数	文件大小	规格书
8页	126K
描述
Infrared LED, 830nm

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技术参数
数据手册

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TSMG2700-GS08 技术参数

是否Rohs认证：	符合	生命周期：	Obsolete
Reach Compliance Code：	unknown	风险等级：	5.84
最大正向电流：	0.1 A	最大正向电压：	1.8 V
JESD-609代码：	e3	安装特点：	SURFACE MOUNT
最高工作温度：	85 °C	最低工作温度：	-40 °C
峰值波长：	830 nm	最大反向电压：	5 V
半导体材料：	GaAlAs	光谱带宽：	4e-8 m
子类别：	Infrared LEDs	表面贴装：	YES
端子面层：	Tin (Sn)	视角：	120 deg
Base Number Matches：	1

TSMG2700-GS08 数据手册

TSMG2700

Vishay Semiconductors

Solder Profile

Tape and Reel

PLCC-2 components are packed in antistatic blister

tape (DIN IEC (CO) 564) for automatic component

insertion. Cavities of blister tape are covered with

adhesive tape.

948625

300

10 s

max. 240 °C ca. 230 °C

250

200

215 °C

Adhesive Tape

150

100

max 40s

max. 160 °C

90 s - 120 s

Lead Temperature

Blister Tape

full line

:typical

2 K/s - 4 K/s

dotted

:process limits

100

Time (s)

200

250

150

Figure 7. Lead Tin (SnPb) Reflow Solder Profile

94 8670

Component Cavity

Drypack

Devices are packed in moisture barrier bags (MBB) to

prevent the products from moisture absorption during

transportation and storage. Each bag contains a des-

iccant.

Figure 8. Blister Tape

3.5

3.1

2.2

2.0

Floor Life

Floor life (time between soldering and removing from

MBB) must not exceed the time indicated in

J-STD-020. TSMG2700 is released for:

Moisture Sensitivity Level 2, according to

JEDEC, J-STD-020

5.75

5.25

4.0

3.6

8.3

7.7

3.6

3.4

Floor Life: 1 year

Conditions: Tamb < 30 °C, RH < 60 %

1.85

1.65

0.25

1.6

1.4

4.1

3.9

4.1

3.9

Drying

2.05

1.95

In case of moisture absorption devices should be

baked before soldering. Conditions see J-STD-020 or

Label. Devices taped on reel dry using recommended

conditions 192 h at 40 °C (+ 5 °C), RH < 5 %.

94 8668

Figure 9. Tape Dimensions in mm for PLCC-2

Document Number 81107

Rev. 1.4, 28-Nov-06

www.vishay.com

1 2 3 456 7 8

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