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TSM4435BCSRL PDF预览

TSM4435BCSRL

更新时间: 2024-11-11 12:19:11
品牌 Logo 应用领域
TSC /
页数 文件大小 规格书
6页 210K
描述
30V P-Channel MOSFET

TSM4435BCSRL 技术参数

生命周期:Obsolete包装说明:,
Reach Compliance Code:compliant风险等级:5.84

TSM4435BCSRL 数据手册

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TSM4435B  
30V P-Channel MOSFET  
SOP-8  
Pin Definition:  
1. Source  
2. Source  
3. Source  
4. Gate  
PRODUCT SUMMARY  
8. Drain  
7. Drain  
6. Drain  
5. Drain  
VDS (V)  
RDS(on)(m)  
21 @ VGS = -10V  
35 @ VGS = -4.5V  
ID (A)  
-9.1  
-30  
-6.9  
Features  
Block Diagram  
Advance Trench Process Technology  
High Density Cell Design for Ultra Low On-resistance  
Application  
DC-DC Conversion  
Battery Switch  
Ordering Information  
Part No.  
Package  
Packing  
TSM4435BCS RL  
TSM4435BCS RLG  
SOP-8  
SOP-8  
2.5Kpcs / 13” Reel  
2.5Kpcs / 13” Reel  
P-Channel MOSFET  
Note: “G” denote for Halogen Free Product  
Absolute Maximum Rating (TA = 25oC unless otherwise noted)  
Parameter  
Symbol  
Limit  
-30  
Unit  
V
Drain-Source Voltage  
VDS  
VGS  
ID  
Gate-Source Voltage  
±20  
V
Continuous Drain Current  
Pulsed Drain Current  
Continuous Source Current (Diode Conduction)a,b  
-9.1  
A
IDM  
IS  
-50  
A
-2.1  
A
Ta = 25oC  
Ta = 75oC  
2.5  
Maximum Power Dissipation  
PD  
W
1.6  
Operating Junction Temperature  
TJ  
+150  
- 55 to +150  
oC  
oC  
Operating Junction and Storage Temperature Range  
TJ, TSTG  
Thermal Performance  
Parameter  
Symbol  
Limit  
22  
Unit  
oC/W  
oC/W  
Junction to Foot (Drain) Thermal Resistance  
RӨ  
JF  
Junction to Ambient Thermal Resistance (PCB mounted)  
Notes:  
RӨ  
50  
JA  
a. Pulse width limited by the Maximum junction temperature  
b. Surface Mounted on FR4 Board, t 10 sec.  
1/6  
Version: A11  

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