是否无铅: | 不含铅 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | QFN |
包装说明: | QFN-20 | 针数: | 20 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8542.39.00.01 | Factory Lead Time: | 6 weeks |
风险等级: | 0.8 | Is Samacsys: | N |
可调阈值: | YES | 模拟集成电路 - 其他类型: | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码: | R-PQCC-N20 | JESD-609代码: | e4 |
长度: | 4.5 mm | 湿度敏感等级: | 1 |
信道数量: | 3 | 功能数量: | 1 |
端子数量: | 20 | 最高工作温度: | 125 °C |
最低工作温度: | -55 °C | 封装主体材料: | PLASTIC/EPOXY |
封装代码: | HVQCCN | 封装等效代码: | LCC20/24,.14X.18,20 |
封装形状: | RECTANGULAR | 封装形式: | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
峰值回流温度(摄氏度): | 260 | 电源: | 2.5/6 V |
认证状态: | Not Qualified | 座面最大高度: | 0.9 mm |
子类别: | Power Management Circuits | 最大供电电流 (Isup): | 0.15 mA |
最大供电电压 (Vsup): | 6.5 V | 最小供电电压 (Vsup): | 2.2 V |
标称供电电压 (Vsup): | 3 V | 表面贴装: | YES |
温度等级: | MILITARY | 端子面层: | Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式: | NO LEAD | 端子节距: | 0.5 mm |
端子位置: | QUAD | 处于峰值回流温度下的最长时间: | NOT SPECIFIED |
宽度: | 3.5 mm | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
TPS75003RHLR | TI |
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Triple-Supply Power Management IC for Powering FPGAs and DSPs | |
TPS75003RHLRG4 | TI |
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Triple-Supply Power Management IC for Powering FPGAs and DSPs | |
TPS75003RHLT | TI |
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Triple-Supply Power Management IC for Powering FPGAs and DSPs | |
TPS75003RHLTG4 | TI |
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Triple-Supply Power Management IC for Powering FPGAs and DSPs | |
TPS75005 | TI |
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Integrated MCU Power Solution for C2000⢠Mi | |
TPS75005_14 | TI |
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Integrated MCU Power Solution for C2000⢠Mi | |
TPS75005EVM-023 | TI |
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TPS75005EVM-023 | |
TPS75005RGW | TI |
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TPS75005EVM-023 | |
TPS75005RGWR | TI |
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Integrated MCU Power Solution for C2000⢠Mi | |
TPS75005RGWT | TI |
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Integrated MCU Power Solution for C2000⢠Mi |