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TPS75103 PDF预览

TPS75103

更新时间: 2024-09-22 12:16:19
品牌 Logo 应用领域
德州仪器 - TI 驱动器
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19页 588K
描述
Low Dropout, Two-Bank LED Driver with PWM Brightness Control

TPS75103 数据手册

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TPS7510x  
www.ti.com  
SBVS080H SEPTEMBER 2006REVISED JANUARY 2010  
Low Dropout, Two-Bank LED Driver with PWM Brightness Control  
1
FEATURES  
DESCRIPTION  
2
Regulated Output Current with 2% LED-to-LED  
Matching  
The TPS7510x linear low dropout (LDO) matching  
LED current source is optimized for low power  
keypad and navigation pad LED backlighting  
applications. The device provides a constant current  
to up to four unmatched LEDs organized in two banks  
of two LEDs each in a common-cathode topology.  
Without an external resistor, the current source  
defaults to factory-programmable, preset current level  
with ±0.5% accuracy (typical). An optional external  
resistor can be used to set initial brightness to  
user-programmable values with higher accuracy.  
Brightness can be varied from off to full brightness by  
inputting a pulse width modulation (PWM) signal on  
each Enable pin. Each bank has independent enable  
and brightness control, but current matching is done  
to all four channels concurrently. The input supply  
range is ideally suited for single-cell Li-Ion battery  
supplies and the TPS7510x can provide up to 25mA  
per LED.  
Drives Up to Four LEDs at 25mA Each in a  
Common Cathode Topology  
28mV Typical Dropout Voltage Extends Usable  
Supply Range in Li-Ion Battery Applications  
Brightness Control Using PWM Signals  
Two 2-LED Banks with Independent Enable  
and PWM Brightness Control per Bank  
No Internal Switching Signals—Eliminates EMI  
Default LED Current Eliminates External  
Components  
Default values from 3mA to 10mA (in 1mA  
increments) available using innovative  
factory EEPROM programming  
Optional external resistor can be used for  
high-accuracy, user-programmable current  
No internal switching signals are used, eliminating  
troublesome electromagnetic interference (EMI). The  
TPS7510x is offered in an ultra-small, 9-ball, 0.4mm  
ball-pitch wafer chip-scale package (WCSP) and a  
2,5mm × 2,5mm, 10-pin SON package, yielding a  
very compact total solution size ideal for mobile  
handsets and portable backlighting applications. The  
device is fully specified over TJ = –40°C to +85°C.  
Over-Current and Over-Temperature  
Protection  
Available in Wafer Chip-Scale Package  
or 2,5mm × 2,5mm SON-10  
APPLICATIONS  
Keypad and Display Backlighting  
White and Color LEDs  
Cellular Handsets  
PDAs and Smartphones  
VBATT  
TPS7510x DSK  
2,5mm x 2,5mm SON-10  
(Top View)  
TPS7510x  
TPS7510x YFF  
9-Ball WCSP  
(Top View)  
VIN  
D1A  
VENA  
VENB  
ENA  
ENB  
D2A  
ENB  
ENA  
D1A  
D2A  
GND  
1
2
3
4
5
10 ISET  
9
8
7
6
VIN  
A3 B3  
A2 B2  
A1 B1  
C3  
C2  
C1  
D1B  
D2B  
GND  
D1B  
D2B  
NC  
ISET  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
All trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2006–2010, Texas Instruments Incorporated  

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