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TPS65910

更新时间： 2024-09-16 11:44:23
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德州仪器 - TI /
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96页 1368K
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Integrated Power Management Unit Top Specification

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TPS65910, TPS65910A, TPS65910A3, TPS659101, TPS659102, TPS659103  
TPS659104, TPS659105, TPS659106, TPS659107, TPS659108, TPS659109  
www.ti.com  
SWCS046N –MARCH 2010–REVISED APRIL 2012  
Integrated Power Management Unit Top Specification  
Check for  
Samples: TPS65910, TPS65910A, TPS65910A3, TPS659101, TPS659102, TPS659103, TPS659104, TPS659105, TPS659106,  
TPS659107, TPS659108, TPS659109  
1
FEATURES  
APPLICATIONS  
The purpose of the TPS65910 device is to  
provide the following resources:  
•
•
Portable and handheld systems  
OMAP3 power management  
•
•
Embedded power controller  
DESCRIPTION  
Two efficient step-down dc-dc converters for  
processor cores  
The TPS65910 is an integrated power-management  
IC available in 48-QFN package and dedicated to  
applications powered by one Li-Ion or Li-Ion polymer  
battery cell or 3-series Ni-MH cells, or by a 5-V input;  
it requires multiple power rails. The device provides  
three step-down converters, one step-up converter,  
and eight LDOs and is designed to support the  
specific power requirements of OMAP-based  
applications.  
•
One efficient step-down dc-dc converter for I/O  
power  
•
•
One efficient step-up 5-V dc-dc converter  
SmartReflex™ compliant dynamic voltage  
management for processor cores  
•
•
•
•
8 LDO voltage regulators and one RTC LDO  
(internal purpose)  
One high-speed I2C interface for general-  
Two of the step-down converters provide power for  
dual processor cores and are controllable by a  
dedicated class-3 SmartReflex interface for optimum  
power savings. The third converter provides power for  
the I/Os and memory in the system.  
purpose control commands (CTL-I2C)  
One high-speed I2C interface for SmartReflex  
Class 3 control and command (SR-I2C)  
Two enable signals multiplexed with SR-I2C,  
configurable to control any supply state and  
processor cores supply voltage  
The device includes eight general-purpose LDOs  
providing a wide range of voltage and current  
capabilities; they are fully controllable by the I2C  
interface. The use of the LDOs is flexible; they are  
intended to be used as follows: Two LDOs are  
designated to power the PLL and video DAC supply  
rails on the OMAP based processors, four general-  
purpose auxiliary LDOs are available to provide  
power to other devices in the system, and two LDOs  
are provided to power DDR memory supplies in  
applications requiring these memories.  
•
•
Thermal shutdown protection and hot-die  
detection  
A real-time clock (RTC) resource with:  
–
Oscillator for 32.768-kHz crystal or 32-kHz  
built-in RC oscillator  
–
–
Date, time and calendar  
Alarm capability  
In addition to the power resources, the device  
contains an embedded power controller (EPC) to  
manage the power sequencing requirements of the  
OMAP systems and an (RTC).  
•
•
One configurable GPIO  
DC-DC switching synchronization through  
internal or external 3-MHz clock  
Figure 1 shows the top-level diagram of the device.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2010–2012, Texas Instruments Incorporated  
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