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TPD2E007

更新时间： 2024-11-23 05:53:19
品牌 Logo 应用领域
德州仪器 - TI /
页数 文件大小 规格书
9页 420K
描述
2-CHANNEL ESD-PROTECTION ARRAY FOR AC-COUPLED/NEGATIVE-RAIL DATA INTERFACES

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TPD2E007 数据手册

 浏览型号TPD2E007的Datasheet PDF文件第2页浏览型号TPD2E007的Datasheet PDF文件第3页浏览型号TPD2E007的Datasheet PDF文件第4页浏览型号TPD2E007的Datasheet PDF文件第5页浏览型号TPD2E007的Datasheet PDF文件第6页浏览型号TPD2E007的Datasheet PDF文件第7页 
TPD2E007  
www.ti.com ........................................................................................................................................ SLVS796D–SEPTEMBER 2008–REVISED OCTOBER 2009  
2-CHANNEL ESD-PROTECTION ARRAY  
FOR AC-COUPLED/NEGATIVE-RAIL DATA INTERFACES  
1
FEATURES  
YFMG4 PACKAGE  
(BOTTOM VIEW)  
2
•
ESD Protection Exceeds IEC61000-4-2  
(Level 4)  
–
–
–
±15-kV Human-Body Model (HBM)  
B1  
A1  
B2  
A2  
GND  
IO1  
GND  
IO2  
±8-kV IEC 61000-4-2 Contact Discharge  
±15-kV IEC 61000-4-2 Air-Gap Discharge  
•
•
•
•
•
4.5-A Peak Pulse Current (8/20 ms Pulse)  
15-pF Line to GND Capacitance  
Low 50-nA Leakage Current  
0.8 mm × 0.8 mm (0.4 mm pitch)  
YFMG4 PIN DESCRIPTIONS  
2-Channel Device  
TERMINAL  
NAME NO.  
IO A1, A2 ESD-protection channel  
GND B1, B2 Ground  
Space-Saving PicoStar™ and DCK Package  
DESCRIPTION  
APPLICATIONS  
•
•
•
•
Cell Phones, PDAs  
Audio Interface Connections  
Consumer Electronics (DVR, Set-Top Box, TV)  
Industrial Interface (RS-232, RS-485, RS-422,  
LVDS)  
DCK PACKAGE  
(TOP VIEW)  
1
3
2
IO1  
IO2  
GND  
DESCRIPTION/ORDERING INFORMATION  
This device is an application-specific integrated parts (ASIP) designed to offer system level ESD solutions for  
wide range of portable and industrial applications. The back-to-back diode array allows AC-coupled or  
negative-going data transmission (audio interface, LVDS, RS-485, RS-232, etc.) without compromising signal  
integrity. The PicoStar™ package is intended to be embedded inside the printed circuit board which saves board  
space in portable applications. This device exceeds the IEC61000-4-2 (Level 4) ESD protection and suitable to  
provide system level ESD protection for the valuable internal ICs while placed near the connector.  
The TPD2E007 is offered in a 4-bump PicoStar™ and 3-pin DCK packages. The PicoStar™ package (YFMG4),  
with only 0.15 mm (Max) package height, is recommended for ultra space saving application where the package  
height is a key concern. The PicoStar package can be used in either embedded PCB board applications or in  
surface mount applications. The industry standard DCK package offers straightforward board layout option in  
legacy designs.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
PicoStar is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2008–2009, Texas Instruments Incorporated  
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