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TPD2E009_14

更新时间: 2024-11-24 02:58:23
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德州仪器 - TI /
页数 文件大小 规格书
15页 1029K
描述
2-CHANNEL ESD SOLUTION FOR HIGH-SPEED (6 GBPS) DIFFERENTIAL INTERFACE

TPD2E009_14 数据手册

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TPD2E009  
www.ti.com.............................................................................................................................................................. SLVS953AJUNE 2009REVISED JUNE 2009  
2-CHANNEL ESD SOLUTION FOR HIGH-SPEED (6 GBPS) DIFFERENTIAL INTERFACE  
1
FEATURES  
DBZ/DRT PACKAGE  
0.05-pF Matching Capacitance Between the  
Differential Signal Pair  
(TOP VIEW)  
1
D+  
D–  
Single-Pair Differential Lines to Protect the  
Differential Data and Clock Lines of the LVDS,  
SATA, Ethernet, or USB High-Speed (HS)  
Interface  
3
GND  
2
Flow-Through Pin Mapping for the High-Speed  
Lines Ensures Zero Additional Skew Due to  
Board Layout While Placing ESD-Protection  
Chip Near the Connector  
DRY PACKAGE  
(TOP VIEW)  
6
5
4
N.C.  
1
2
3
D+  
V
Supports Data Rates in Excess of 6 Gbps  
GND  
N.C
CC  
ESD Protection Meets or Exceeds  
IEC61000-4-2 (Level 4)  
D–  
5-A Peak Pulse Current (8/20 µs Pulse) for  
VBUS and D+, D–, and ID Lines  
N.C. – No internal connection  
Industrial Temperature Range: –40°C to 85°C  
Multiple Space-Saving Package Options  
APPLICATIONS  
Notebooks  
Set-Top Boxes  
DVD Players  
Media Players  
Portable Computers  
DESCRIPTION/ORDERING INFORMATION  
The TPD2E009 provides 2 ESD clamp circuits with flow-through pin mapping for ease of board layout. This  
device has been designed to protect sensitive components which are connected to ultra high-speed data and  
transmission lines. The TPD2E009 offers protection from stress caused by ESD (electrostatic discharge). This  
device also offers 5 A (8/20 µs) peak pulse current ratings per IEC 61000-4-5 (lightning) specification.  
The monolithic silicon technology allows matching between the differential signal pairs. The less than differential  
0.05-pF capacitance ensures that the differential signal distortion due to added ESD clamp remains minimal. The  
0.7-pF line capacitance is suitable for high-speed data rate (in excess of 6 Gbps).  
The TPD2E009 conforms to IEC61000-4-2 (Level 4) ESD protection. The DRT (1 mm × 1 mm) package is  
offered for space-saving portable applications. The industry standard DBZ (2.4 mm × 2.9 mm) package offers  
additional flexibility in the board layout for the system designer.  
The TPD2E009 is characterized for operation over ambient air temperature range of –40°C to 85°C.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2009, Texas Instruments Incorporated  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  

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