TPD2E009
www.ti.com.............................................................................................................................................................. SLVS953A–JUNE 2009–REVISED JUNE 2009
2-CHANNEL ESD SOLUTION FOR HIGH-SPEED (6 GBPS) DIFFERENTIAL INTERFACE
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FEATURES
DBZ/DRT PACKAGE
•
0.05-pF Matching Capacitance Between the
Differential Signal Pair
(TOP VIEW)
1
D+
D–
•
Single-Pair Differential Lines to Protect the
Differential Data and Clock Lines of the LVDS,
SATA, Ethernet, or USB High-Speed (HS)
Interface
3
GND
2
•
Flow-Through Pin Mapping for the High-Speed
Lines Ensures Zero Additional Skew Due to
Board Layout While Placing ESD-Protection
Chip Near the Connector
DRY PACKAGE
(TOP VIEW)
6
5
4
N.C.
1
2
3
D+
V
•
•
Supports Data Rates in Excess of 6 Gbps
GND
N.C.
CC
ESD Protection Meets or Exceeds
IEC61000-4-2 (Level 4)
D–
•
5-A Peak Pulse Current (8/20 µs Pulse) for
VBUS and D+, D–, and ID Lines
N.C. – No internal connection
•
•
Industrial Temperature Range: –40°C to 85°C
Multiple Space-Saving Package Options
APPLICATIONS
•
•
•
•
•
Notebooks
Set-Top Boxes
DVD Players
Media Players
Portable Computers
DESCRIPTION/ORDERING INFORMATION
The TPD2E009 provides 2 ESD clamp circuits with flow-through pin mapping for ease of board layout. This
device has been designed to protect sensitive components which are connected to ultra high-speed data and
transmission lines. The TPD2E009 offers protection from stress caused by ESD (electrostatic discharge). This
device also offers 5 A (8/20 µs) peak pulse current ratings per IEC 61000-4-5 (lightning) specification.
The monolithic silicon technology allows matching between the differential signal pairs. The less than differential
0.05-pF capacitance ensures that the differential signal distortion due to added ESD clamp remains minimal. The
0.7-pF line capacitance is suitable for high-speed data rate (in excess of 6 Gbps).
The TPD2E009 conforms to IEC61000-4-2 (Level 4) ESD protection. The DRT (1 mm × 1 mm) package is
offered for space-saving portable applications. The industry standard DBZ (2.4 mm × 2.9 mm) package offers
additional flexibility in the board layout for the system designer.
The TPD2E009 is characterized for operation over ambient air temperature range of –40°C to 85°C.
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Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2009, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.