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TPD2E007YFMR

更新时间： 2024-11-26 07:04:43
品牌 Logo 应用领域
德州仪器 - TI 瞬态抑制器二极管局域网
页数 文件大小 规格书
9页 420K
描述
2-CHANNEL ESD-PROTECTION ARRAY FOR AC-COUPLED/NEGATIVE-RAIL DATA INTERFACES

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中文翻译

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TPD2E007YFMR 技术参数

是否无铅： 含铅是否Rohs认证： 符合
生命周期：Obsolete零件包装代码：LGA
包装说明：0.8 MM X 0.8 MM, DSLGA-4针数：4
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8541.10.00.50风险等级：5.75
Is Samacsys：N最小击穿电压：14 V
击穿电压标称值：14 V配置：COMPLEX
二极管元件材料：SILICON二极管类型：TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 代码：S-XBCC-N4元件数量：4
端子数量：4封装主体材料：UNSPECIFIED
封装形状：SQUARE封装形式：CHIP CARRIER
峰值回流温度（摄氏度）：NOT SPECIFIED极性：BIDIRECTIONAL
最大功率耗散：0.27 W认证状态：Not Qualified
子类别：Transient Suppressors表面贴装：YES
技术：AVALANCHE端子形式：NO LEAD
端子位置：BOTTOM处于峰值回流温度下的最长时间：NOT SPECIFIED
Base Number Matches：1

TPD2E007YFMR 数据手册

 浏览型号TPD2E007YFMR的Datasheet PDF文件第2页浏览型号TPD2E007YFMR的Datasheet PDF文件第3页浏览型号TPD2E007YFMR的Datasheet PDF文件第4页浏览型号TPD2E007YFMR的Datasheet PDF文件第5页浏览型号TPD2E007YFMR的Datasheet PDF文件第6页浏览型号TPD2E007YFMR的Datasheet PDF文件第7页 
TPD2E007  
www.ti.com ........................................................................................................................................ SLVS796D–SEPTEMBER 2008–REVISED OCTOBER 2009  
2-CHANNEL ESD-PROTECTION ARRAY  
FOR AC-COUPLED/NEGATIVE-RAIL DATA INTERFACES  
1
FEATURES  
YFMG4 PACKAGE  
(BOTTOM VIEW)  
2
•
ESD Protection Exceeds IEC61000-4-2  
(Level 4)  
–
–
–
±15-kV Human-Body Model (HBM)  
B1  
A1  
B2  
A2  
GND  
IO1  
GND  
IO2  
±8-kV IEC 61000-4-2 Contact Discharge  
±15-kV IEC 61000-4-2 Air-Gap Discharge  
•
•
•
•
•
4.5-A Peak Pulse Current (8/20 ms Pulse)  
15-pF Line to GND Capacitance  
Low 50-nA Leakage Current  
0.8 mm × 0.8 mm (0.4 mm pitch)  
YFMG4 PIN DESCRIPTIONS  
2-Channel Device  
TERMINAL  
NAME NO.  
IO A1, A2 ESD-protection channel  
GND B1, B2 Ground  
Space-Saving PicoStar™ and DCK Package  
DESCRIPTION  
APPLICATIONS  
•
•
•
•
Cell Phones, PDAs  
Audio Interface Connections  
Consumer Electronics (DVR, Set-Top Box, TV)  
Industrial Interface (RS-232, RS-485, RS-422,  
LVDS)  
DCK PACKAGE  
(TOP VIEW)  
1
3
2
IO1  
IO2  
GND  
DESCRIPTION/ORDERING INFORMATION  
This device is an application-specific integrated parts (ASIP) designed to offer system level ESD solutions for  
wide range of portable and industrial applications. The back-to-back diode array allows AC-coupled or  
negative-going data transmission (audio interface, LVDS, RS-485, RS-232, etc.) without compromising signal  
integrity. The PicoStar™ package is intended to be embedded inside the printed circuit board which saves board  
space in portable applications. This device exceeds the IEC61000-4-2 (Level 4) ESD protection and suitable to  
provide system level ESD protection for the valuable internal ICs while placed near the connector.  
The TPD2E007 is offered in a 4-bump PicoStar™ and 3-pin DCK packages. The PicoStar™ package (YFMG4),  
with only 0.15 mm (Max) package height, is recommended for ultra space saving application where the package  
height is a key concern. The PicoStar package can be used in either embedded PCB board applications or in  
surface mount applications. The industry standard DCK package offers straightforward board layout option in  
legacy designs.  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas  
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
PicoStar is a trademark of Texas Instruments.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2008–2009, Texas Instruments Incorporated  
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TPD2E007YFMR 替代型号

型号 品牌 替代类型 描述 数据表
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