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TPA2000D4DAPG4 PDF预览

TPA2000D4DAPG4

更新时间: 2024-11-10 03:58:47
品牌 Logo 应用领域
德州仪器 - TI 消费电路商用集成电路音频放大器视频放大器功率放大器光电二极管
页数 文件大小 规格书
27页 643K
描述
STEREO 2-W CLASS-D AUDIO POWER AMPLIFIER WITH STEREO HP AMPLIFIER

TPA2000D4DAPG4 技术参数

是否无铅: 含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:TSSOP
包装说明:PLASTIC, HTSSOP-32针数:32
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.33.00.01风险等级:5.24
Is Samacsys:N标称带宽:20 kHz
商用集成电路类型:AUDIO AMPLIFIER增益:23.5 dB
谐波失真:0.1%JESD-30 代码:R-PDSO-G32
长度:11 mm信道数量:2
功能数量:1端子数量:32
最高工作温度:85 °C最低工作温度:-40 °C
标称输出功率:2 W封装主体材料:PLASTIC/EPOXY
封装代码:HTSSOP封装等效代码:TSSOP32,.3
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度):NOT SPECIFIED电源:5 V
认证状态:Not Qualified座面最大高度:1.2 mm
子类别:Audio/Video Amplifiers最大压摆率:12 mA
最大供电电压 (Vsup):5.5 V最小供电电压 (Vsup):3.7 V
表面贴装:YES技术:CMOS
温度等级:INDUSTRIAL端子形式:GULL WING
端子节距:0.65 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:6.1 mm
Base Number Matches:1

TPA2000D4DAPG4 数据手册

 浏览型号TPA2000D4DAPG4的Datasheet PDF文件第2页浏览型号TPA2000D4DAPG4的Datasheet PDF文件第3页浏览型号TPA2000D4DAPG4的Datasheet PDF文件第4页浏览型号TPA2000D4DAPG4的Datasheet PDF文件第5页浏览型号TPA2000D4DAPG4的Datasheet PDF文件第6页浏览型号TPA2000D4DAPG4的Datasheet PDF文件第7页 
ꢀ ꢁꢂ ꢃꢄꢄ ꢄꢅ ꢆ  
ꢇꢀ ꢈꢉ ꢈꢊ ꢃ ꢋꢌ ꢍꢎ ꢂꢇꢇ ꢋꢅ ꢂꢏꢅ ꢐꢊ ꢁꢊ ꢌ ꢈꢉ ꢂꢑ ꢁ ꢎꢐ ꢒꢐ ꢈꢉ  
ꢌ ꢐꢀ ꢓ ꢇꢀ ꢈꢉ ꢈꢊ ꢓꢁ ꢂꢑ ꢁ ꢎꢐ ꢒꢐ ꢈꢉ  
SLOS337B − DECEMBER 2000 − REVISED NOVEMBER 2005  
DAP PACKAGE  
(TOP VIEW)  
D
Ideal for Notebook PCs and USB-Powered  
Speakers  
D
D
D
2 W Into 4 From 5-V Supply  
Integrated Class-AB Headphone Amplifier  
1
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
LINN  
LINP  
RINN  
RINP  
2
3
HPLIN  
GAIN0  
GAIN1  
PVDDL  
LOUTP  
PGNDL  
PGNDL  
LOUTN  
PVDDL  
HPRIN  
BYPASS  
SHUTDOWN  
PVDDR  
ROUTP  
PGNDR  
PGNDR  
ROUTN  
PVDDR  
NC  
Second-Generation Modulation Technique  
− Filterless Operation  
− Improved Efficiency  
4
5
6
D
D
D
D
Low Supply Current . . . 9 mA typ at 5 V  
Shutdown Control . . . < 0.05 µA Typ  
Shutdown Pin Is TTL Compatible  
7
8
9
10  
11  
12  
13  
14  
15  
16  
−40°C to 85°C Operating Temperature  
Range  
HPLGAIN  
HPLOUT  
MODE  
HPRGAIN  
HPROUT  
D
Space-Saving, Thermally-Enhanced  
PowerPADPackaging  
VDD  
COSC  
ROSC  
AGND  
description  
NC − No internal connection  
The TPA2000D4 is a 2-W stereo bridge-tied-load  
(BTL) class-D amplifier designed to drive  
speakers with as low as 4-impedance. The amplifier uses TI’s second-generation modulation technique,  
which results in improved efficiency and SNR, and also allows the device to be connected directly to the speaker  
without the use of the LC output filter commonly associated with class-D amplifiers (this will result in an EMI  
which must be shielded at the system level). These features make the device ideal for use in notebook PCs  
where high-efficiency is needed to extend battery run-time. For speakers powered off the USB bus, the  
high-efficiency allows for higher output power levels without tripping the USB’s overcurrent circuitry.  
The gain of the amplifier is controlled by two input terminals, GAIN1, and GAIN0. This allows the amplifier to  
be configured for a gain of 6, 12, 18, and 23.5 dB. The differential input terminals are high-impedance CMOS  
inputs, and can be used as summing nodes.  
The headphone amplifier is a stereo single-ended (SE) class-AB amplifier which requires two external resistors  
per channel to set the gain. The MODE pin selects which amplifier is active; the unused amplifier is placed in  
shutdown to reduce supply current.  
Both the class-D BTL amplifier, and the class-AB SE amplifier include depop circuitry to reduce the amount of  
turnon pop at power up, when cycling SHUTDOWN, and when switching modes of operation.  
The TPA2000D4 is available in the 32-pin thermally-enhanced TSSOP package (DAP) which allows stereo 2-W  
continuous output power levels in 4-loads when placed on a board with proper thermal board design. The  
TPA2000D4 operates over an ambient temperature range of −40°C to 85°C.  
These packages deliver levels of thermal performance that were previously only achievable in TO-220-type  
packages. Thermal impedances of less than 35°C/W are readily realized in multilayer PCB applications when  
using the DAP package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PowerPAD is a trademark of Texas Instruments.  
ꢀꢠ  
Copyright 2000−2005, Texas Instruments Incorporated  
ꢜ ꢠ ꢝ ꢜꢕ ꢖꢪ ꢘꢗ ꢛ ꢣꢣ ꢡꢛ ꢙ ꢛ ꢚ ꢠ ꢜ ꢠ ꢙ ꢝ ꢥ  
1
WWW.TI.COM  

TPA2000D4DAPG4 替代型号

型号 品牌 替代类型 描述 数据表
TPA2000D4DAPRG4 TI

完全替代

2-W Stereo Class-D Audio Amplifier with Stereo Class-AB Headphone Drive 32-HTSSOP -40 to 8
TPA2000D4DAPR TI

完全替代

STEREO 2-W CLASS-D AUDIO POWER AMPLIFIER WITH STEREO HP AMPLIFIER
TPA2000D4DAP TI

功能相似

STEREO 2-W CLASS-D AUDIO POWER AMPLIFIER WITH STEREO HP AMPLIFIER

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