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TPA2000D4DAP PDF预览

TPA2000D4DAP

更新时间： 2024-11-24 22:40:27
品牌 Logo 应用领域
德州仪器 - TI 消费电路商用集成电路音频放大器视频放大器功率放大器光电二极管
页数 文件大小 规格书
24页 409K
描述
STEREO 2-W CLASS-D AUDIO POWER AMPLIFIER WITH STEREO HP AMPLIFIER

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中文翻译

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TPA2000D4DAP 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active零件包装代码：TSSOP
包装说明：HTSSOP-32针数：32
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8542.33.00.01Factory Lead Time：1 week
风险等级：0.97Is Samacsys：N
标称带宽：20 kHz商用集成电路类型：AUDIO AMPLIFIER
增益：100 dB谐波失真：0.1%
JESD-30 代码：R-PDSO-G32JESD-609代码：e4
长度：11 mm湿度敏感等级：3
信道数量：2功能数量：1
端子数量：32最高工作温度：85 °C
最低工作温度：-40 °C标称输出功率：2 W
封装主体材料：PLASTIC/EPOXY封装代码：HTSSOP
封装等效代码：TSSOP32,.3封装形状：RECTANGULAR
封装形式：SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH峰值回流温度（摄氏度）：260
电源：5 V认证状态：Not Qualified
座面最大高度：1.2 mm子类别：Audio/Video Amplifiers
最大压摆率：12 mA最大供电电压 (Vsup)：5.5 V
最小供电电压 (Vsup)：3.7 V表面贴装：YES
技术：CMOS温度等级：INDUSTRIAL
端子面层：Nickel/Palladium/Gold (Ni/Pd/Au)端子形式：GULL WING
端子节距：0.65 mm端子位置：DUAL
处于峰值回流温度下的最长时间：NOT SPECIFIED宽度：6.1 mm
Base Number Matches：1

TPA2000D4DAP 数据手册

 浏览型号TPA2000D4DAP的Datasheet PDF文件第2页浏览型号TPA2000D4DAP的Datasheet PDF文件第3页浏览型号TPA2000D4DAP的Datasheet PDF文件第4页浏览型号TPA2000D4DAP的Datasheet PDF文件第5页浏览型号TPA2000D4DAP的Datasheet PDF文件第6页浏览型号TPA2000D4DAP的Datasheet PDF文件第7页 
TPA2000D4  
STEREO 2-W CLASS-D AUDIO POWER AMPLIFIER  
WITH STEREO HP AMPLIFIER  
SLOS337A – DECEMBER 2000 – REVISED MAY 2003  
DAP PACKAGE  
(TOP VIEW)  
D
Ideal for Notebook PCs and USB-Powered  
Speakers  
D
D
D
2 W Into 4 Ω From 5-V Supply  
1
32  
31  
30  
29  
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
LINN  
LINP  
HPLIN  
GAIN0  
GAIN1  
RINN  
RINP  
2
Integrated Class-AB Headphone Amplifier  
3
HPRIN  
BYPASS  
SHUTDOWN  
PVDDR  
ROUTP  
PGNDR  
PGNDR  
ROUTN  
PVDDR  
NC  
Second-Generation Modulation Technique  
– Filterless Operation  
– Improved Efficiency  
4
5
6
PVDDL  
LOUTP  
PGNDL  
PGNDL  
LOUTN  
PVDDL  
HPLGAIN  
HPLOUT  
MODE  
D
D
D
D
Low Supply Current . . . 9 mA typ at 5 V  
Shutdown Control . . . < 0.05 µA Typ  
Shutdown Pin Is TTL Compatible  
7
8
9
10  
11  
12  
13  
14  
15  
16  
–40°C to 85°C Operating Temperature  
Range  
D
Space-Saving, Thermally-Enhanced  
PowerPAD Packaging  
VDD  
COSC  
ROSC  
AGND  
HPRGAIN  
HPROUT  
description  
The TPA2000D4 is a 2-W stereo bridge-tied-load  
(BTL) class-D amplifier designed to drive  
NC – No internal connection  
speakers with as low as 4-Ω impedance. The amplifier uses TI’s second-generation modulation technique,  
which results in improved efficiency and SNR, and also allows the device to be connected directly to the speaker  
without the use of the LC output filter commonly associated with class-D amplifiers (this will result in an EMI  
which must be shielded at the system level). These features make the device ideal for use in notebook PCs  
where high-efficiency is needed to extend battery run-time. For speakers powered off the USB bus, the  
high-efficiency allows for higher output power levels without tripping the USB’s overcurrent circuitry.  
The gain of the amplifier is controlled by two input terminals, GAIN1, and GAIN0. This allows the amplifier to  
be configured for a gain of 6, 12, 18, and 23.5 dB. The differential input terminals are high-impedance CMOS  
inputs, and can be used as summing nodes.  
The headphone amplifier is a stereo single-ended (SE) class-AB amplifier which requires two external resistors  
per channel to set the gain. The MODE pin selects which amplifier is active; the unused amplifier is placed in  
shutdown to reduce supply current.  
Both the class-D BTL amplifier, and the class-AB SE amplifier include depop circuitry to reduce the amount of  
turnon pop at power up, when cycling SHUTDOWN, and when switching modes of operation.  
The TPA2000D4 is available in the 32-pin thermally-enhanced TSSOP package (DAP) which allows stereo 2-W  
continuous output power levels in 4-Ω loads when placed on a board with proper thermal board design. The  
TPA2000D4 operates over an ambient temperature range of –40°C to 85°C.  
These packages deliver levels of thermal performance that were previously only achievable in TO-220-type  
packages. Thermal impedances of less than 35°C/W are readily realized in multilayer PCB applications when  
using the DAP package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PowerPAD is a trademark of Texas Instruments.  
Copyright 2000–2003, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
1234567...24

中文翻译

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TPA2000D4DAP 替代型号

型号 品牌 替代类型 描述 数据表
TPA2000D4DAPRG4 TI

类似代替

 2-W Stereo Class-D Audio Amplifier with Stereo Class-AB Headphone Drive 32-HTSSOP -40 to 8
TPA2000D4DAPR TI

类似代替

 STEREO 2-W CLASS-D AUDIO POWER AMPLIFIER WITH STEREO HP AMPLIFIER
TPA2000D4DAPG4 TI

功能相似

 STEREO 2-W CLASS-D AUDIO POWER AMPLIFIER WITH STEREO HP AMPLIFIER

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