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TM2EP64DJN PDF预览

TM2EP64DJN

更新时间: 2024-02-17 15:49:27
品牌 Logo 应用领域
德州仪器 - TI /
页数 文件大小 规格书
43页 679K
描述
EXTENDED-DATA-OUT DYNAMIC RAM MODULES

TM2EP64DJN 技术参数

生命周期:Obsolete零件包装代码:DIMM
包装说明:,针数:168
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.32.00.02风险等级:5.84
访问模式:FAST PAGE WITH EDO最长访问时间:50 ns
其他特性:RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESHJESD-30 代码:R-XDMA-N168
内存密度:134217728 bit内存集成电路类型:EDO DRAM MODULE
内存宽度:64功能数量:1
端口数量:1端子数量:168
字数:2097152 words字数代码:2000000
工作模式:ASYNCHRONOUS最高工作温度:70 °C
最低工作温度:组织:2MX64
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:MICROELECTRONIC ASSEMBLY认证状态:Not Qualified
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):3 V
标称供电电压 (Vsup):3.3 V表面贴装:NO
技术:CMOS温度等级:COMMERCIAL
端子形式:NO LEAD端子位置:DUAL
Base Number Matches:1

TM2EP64DJN 数据手册

 浏览型号TM2EP64DJN的Datasheet PDF文件第35页浏览型号TM2EP64DJN的Datasheet PDF文件第36页浏览型号TM2EP64DJN的Datasheet PDF文件第37页浏览型号TM2EP64DJN的Datasheet PDF文件第39页浏览型号TM2EP64DJN的Datasheet PDF文件第40页浏览型号TM2EP64DJN的Datasheet PDF文件第41页 
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SMMS684A − AUGUST 1997 − REVISED FEBRUARY 1998  
serial presence detect (continued)  
Table 3. Serial Presence Detect Data for the TM2EP72DxN  
’2EP72DxN-50  
’2EP72DxN-60  
’2EP72DxN-70  
BYTE  
NO.  
FUNCTION DESCRIBED  
ITEM  
DATA  
ITEM  
DATA  
ITEM  
DATA  
Defines number of bytes written  
into serial memory during module  
manufacturing  
0
128 bytes  
80h  
128 bytes  
80h  
128 bytes  
80h  
Total number of bytes of SPD  
memory device  
1
2
3
4
5
256 bytes  
EDO  
11  
08h  
02h  
0Bh  
0Ah  
01h  
256 bytes  
EDO  
11  
08h  
02h  
0Bh  
0Ah  
01h  
256 bytes  
EDO  
11  
08h  
02h  
0Bh  
0Ah  
01h  
Fundamental memory type (FPM,  
EDO, SDRAM)  
Number of row addresses on this  
assembly  
Number of column addresses on  
this assembly  
10  
10  
10  
Number of module banks on this  
assembly  
1 bank  
72 bits  
1 bank  
72 bits  
1 bank  
72 bits  
6
7
Data width of this assembly  
Data width continuation  
48h  
00h  
48h  
00h  
48h  
00h  
Voltage interface standard of this  
assembly  
8
LVTTL  
01h  
LVTTL  
01h  
LVTTL  
01h  
9
RASx access time of module  
CASx access time of module  
t
t
= 50 ns  
= 13 ns  
32h  
0Dh  
t
t
= 60 ns  
= 15 ns  
3Ch  
0Fh  
t
t
= 70 ns  
= 18 ns  
46h  
12h  
RAC  
RAC  
RAC  
10  
CAC  
CAC  
CAC  
DIMM configuration type  
(non-parity, parity, ECC)  
11  
ECC  
02h  
ECC  
02h  
ECC  
02h  
12  
13  
14  
62  
63  
Refresh rate/type  
15.6 µs  
x8  
00h  
08h  
08h  
01h  
3Bh  
15.6 µs  
x8  
00h  
08h  
08h  
01h  
47h  
15.6 µs  
x8  
00h  
08h  
08h  
01h  
54h  
DRAM width, primary DRAM  
Error-checking SDRAM data width  
SPD revision  
x8  
x8  
x8  
Rev. 1  
59  
Rev. 1  
71  
Rev. 1  
84  
Checksum for bytes 062  
Manufacturer’s JEDEC ID code per  
JEP-106E  
64−71  
97h  
9700...00h  
97h  
9700...00h  
97h  
9700...00h  
72  
73−90  
91  
Manufacturing location  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
TBD  
Manufacturer’s part number  
Die revision code  
PCB revision code  
92  
93−94  
95−98  
Manufacturing date  
Assembly serial number  
99−125 Manufacturer specific data  
126−127 Vendor specific data  
128−166 System integrator’s specific data  
167−255 Open  
TBD indicates values are determined at manufacturing time and are module dependent.  
These TBD values are determined and programmed by the customer (optional).  
39  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443  

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