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TM2EP64DJN-70 PDF预览

TM2EP64DJN-70

更新时间: 2024-11-25 15:54:39
品牌 Logo 应用领域
德州仪器 - TI 动态存储器内存集成电路
页数 文件大小 规格书
22页 327K
描述
2MX64 EDO DRAM MODULE, 18ns, DMA168, DIMM-168

TM2EP64DJN-70 技术参数

生命周期:Obsolete零件包装代码:DIMM
包装说明:DIMM, DIMM168针数:168
Reach Compliance Code:unknownECCN代码:EAR99
HTS代码:8542.32.00.02风险等级:5.84
访问模式:SINGLE BANK PAGE BURST最长访问时间:18 ns
其他特性:CAS BEFORE RAS REFRESHI/O 类型:COMMON
JESD-30 代码:R-XDMA-N168内存密度:134217728 bit
内存集成电路类型:EDO DRAM MODULE内存宽度:64
功能数量:1端口数量:1
端子数量:168字数:2097152 words
字数代码:2000000工作模式:ASYNCHRONOUS
最高工作温度:70 °C最低工作温度:
组织:2MX64输出特性:3-STATE
封装主体材料:UNSPECIFIED封装代码:DIMM
封装等效代码:DIMM168封装形状:RECTANGULAR
封装形式:MICROELECTRONIC ASSEMBLY电源:3.3 V
认证状态:Not Qualified刷新周期:2048
最大待机电流:0.008 A子类别:DRAMs
最大压摆率:0.72 mA最大供电电压 (Vsup):3.6 V
最小供电电压 (Vsup):3 V标称供电电压 (Vsup):3.3 V
表面贴装:NO技术:MOS
温度等级:COMMERCIAL端子形式:NO LEAD
端子节距:1.27 mm端子位置:DUAL
Base Number Matches:1

TM2EP64DJN-70 数据手册

 浏览型号TM2EP64DJN-70的Datasheet PDF文件第2页浏览型号TM2EP64DJN-70的Datasheet PDF文件第3页浏览型号TM2EP64DJN-70的Datasheet PDF文件第4页浏览型号TM2EP64DJN-70的Datasheet PDF文件第5页浏览型号TM2EP64DJN-70的Datasheet PDF文件第6页浏览型号TM2EP64DJN-70的Datasheet PDF文件第7页 
TM2EP64DPN, TM2EP64DJN, TM4EP64DPN, TM4EP64DJN  
TM2EP72DPN, TM2EP72DJN, TM4EP72DPN, TM4EP72DJN  
EXTENDED-DATA-OUT DYNAMIC RAM MODULES  
SMMS684A – AUGUST 1997 – REVISED FEBRUARY 1998  
Organization  
JEDEC 168-Pin Dual-In-Line Memory  
– TM2EP64DxN . . . 2097152 × 64 Bits  
– TM2EP72DxN . . . 2097152 × 72 Bits  
– TM4EP64DxN . . . 4194304 × 64 Bits  
– TM4EP72DxN . . . 4194304 × 72 Bits  
Module (DIMM) Without Buffer for Use With  
Socket  
High-Speed, Low-Noise LVTTL Interface  
Long Refresh Period: 32 ms (2 048 Cycles)  
3-State Output  
Single 3.3-V Power Supply  
(±10% Tolerance)  
Extended-Data-Out (EDO) Operation With  
CAS-Before-RAS (CBR), RAS-Only, and  
Hidden Refresh  
TM2EP64DxN — Uses Eight 16M-Bit  
(2M×8-Bit) Dynamic Random Access  
Memories (DRAMs) in Thin Small-Outline  
Package (TSOP), or Small-Outline J-Lead  
Package (SOJ)  
Serial Presence Detect (SPD) Using  
EEPROM  
Ambient Air Temperature Range  
0°C to 70°C  
TM2EP72DxN — Uses Nine 16M-Bit  
(2M×8-Bit) DRAMs in TSOP, or SOJ  
Gold-Plated Contacts  
TM4EP64DxN — Uses 16 16M-Bit  
(2M×8-Bit) DRAMs in TSOP, or SOJ  
TM4EP72DxN — Uses 18 16M-Bit  
(2M×8-Bit) DRAMs in TSOP, or SOJ  
Performance ranges  
ACCESS ACCESS ACCESS  
TIME TIME TIME  
EDO  
CYCLE  
t
t
t
t
RAC  
CAC  
AA  
HPC  
MAX  
50 ns  
60 ns  
70 ns  
MAX  
13 ns  
15 ns  
18 ns  
MAX  
25 ns  
30 ns  
35 ns  
MIN  
’xEPxxDxN-50  
’xEPxxDxN-60  
’xEPxxDxN-70  
20 ns  
25 ns  
30 ns  
description  
The TM2EP64DPN is a 16M-byte, 168-pin, dual-in-line memory module (DIMM). The DIMM is composed of  
eight TMS427809A, 2097152 byte × 8-bit 2K-refresh EDO DRAMs, each in a 400-mil, 28-pin plastic TSOP  
(DGC suffix) mounted on a substrate with decoupling capacitors. See the TMS427809A data sheet (literature  
number SMKS887). The TM2EP64DJN is available with an SOJ package (DZ suffix).  
The TM2EP72DPN is a 16M-byte, 168-pin DIMM. The DIMM is composed of nine TMS427809A,  
2097152 byte × 8-bit 2K-refresh EDO DRAMs, mounted on a substrate with decoupling capacitors. See the  
TMS427809A data sheet (literature number SMKS887). The TM2EP72DJN is available with an SOJ package  
(DZ suffix).  
The TM4EP64DPN is a 32M-byte, 168-pin, dual-in-line memory module (DIMM). The DIMM is composed of  
sixteen TMS427809A, 2097152 × 8-bit 2K-refresh EDO DRAMs, mounted on a substrate with decoupling  
capacitors. The TM4EP64DJN is available with an SOJ package (DZ suffix).  
The TM4EP72DPN is a 32M-byte, 168-pin DIMM. The DIMM is composed of 18 TMS427809A, 2097152 × 8-bit  
2K-refresh EDO DRAMs, mounted on a substrate with decoupling capacitors. See the TMS427809A data sheet  
(literature number SMKS887). The TM4EP72DJN is available with an SOJ package (DZ suffix).  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 1998, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  

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