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TLYE68CG PDF预览

TLYE68CG

更新时间: 2024-09-16 03:12:11
品牌 Logo 应用领域
东芝 - TOSHIBA 可见光LED光电灯具PC
页数 文件大小 规格书
7页 267K
描述
LED Lamps for mounting on through-hole PCB using an automatic insertion machine

TLYE68CG 技术参数

是否无铅: 含铅是否Rohs认证: 不符合
生命周期:Active包装说明:LEAD FREE PACKAGE-2
Reach Compliance Code:unknownHTS代码:8541.40.20.00
风险等级:5.85Is Samacsys:N
颜色:YELLOW配置:SINGLE
最大正向电流:0.05 A透镜类型:TRANSPARENT
标称发光强度:300.0 mcd安装特点:RADIAL MOUNT
功能数量:1端子数量:2
最高工作温度:100 °C最低工作温度:-40 °C
光电设备类型:SINGLE COLOR LED总高度:5.2 mm
包装方法:BULK峰值波长:590 nm
形状:ROUND尺寸:3.1 mm
表面贴装:NOT代码:T-1
端子节距:2.54 mmBase Number Matches:1

TLYE68CG 数据手册

 浏览型号TLYE68CG的Datasheet PDF文件第2页浏览型号TLYE68CG的Datasheet PDF文件第3页浏览型号TLYE68CG的Datasheet PDF文件第4页浏览型号TLYE68CG的Datasheet PDF文件第5页浏览型号TLYE68CG的Datasheet PDF文件第6页浏览型号TLYE68CG的Datasheet PDF文件第7页 
TLRME68CG(F),TLYE68CG(F),TLGE68CG(F),TLFGE68CG(F)  
TOSHIBA InGaAP LED  
TLRME68CG(F),TLYE68CG(F),TLGE68CG(F),TLFGE68CG(F)  
LED Lamps for mounting on through-hole PCB using  
Unit: mm  
an automatic insertion machine  
Lead(Pb)-free products (lead: Sn-Ag-Cu)  
3mm package wide viewing angle  
Can be mounted on a PCB using an automatic insertion machine  
(please refer to mounting Precautions Using an Automatic Insertion  
Machine)  
InGaAP  
Emitted colors: red, yellow and green  
Colored, Transparent lens  
Applications: Various types of information panels, indicators for  
amusement equipment and panel backlighting  
illumination sources  
Lineup  
Product Name  
Color  
Material  
JEDEC  
JEITA  
TLRME68CG(F)  
TLYE68CG(F)  
TLGE68CG(F)  
TLFGE68CG(F)  
Red  
Yellow  
Green  
Green  
TOSHIBA  
4-3U1  
InGaAlP  
Weight: 0.15 g(Typ.)  
Absolute Maximum Ratings (Ta = 25°C)  
Operating  
Temperature  
(°C)  
Storage  
Temperature  
Tstg (°C)  
Forward Current  
Reverse Voltage  
(V)  
Power Dissipation  
(mW)  
Product Name  
I
(mA)  
V
P
D
F
R
T
opr  
TLRME68CG(F)  
TLYE68CG(F)  
TLGE68CG(F)  
TLFGE68CG(F)  
50  
50  
50  
50  
4
120  
120  
120  
120  
4
4
4
40~100  
40~120  
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even  
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum  
ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
1
2007-10-01  

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