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TLV5580CPWR PDF预览

TLV5580CPWR

更新时间: 2024-02-01 18:20:02
品牌 Logo 应用领域
罗彻斯特 - ROCHESTER 光电二极管转换器
页数 文件大小 规格书
38页 1181K
描述
1-CH 8-BIT PROPRIETARY METHOD ADC, PARALLEL ACCESS, PDSO28, GREEN, PLASTIC, TSSOP-28

TLV5580CPWR 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Obsolete零件包装代码:SSOP
包装说明:TSSOP, TSSOP28,.25针数:28
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.39.00.01风险等级:5.72
最大模拟输入电压:3.5 V最小模拟输入电压:0.8 V
最长转换时间:0.0125 µs转换器类型:ADC, PROPRIETARY METHOD
JESD-30 代码:R-PDSO-G28长度:9.7 mm
最大线性误差 (EL):0.9375%模拟输入通道数量:1
位数:8功能数量:1
端子数量:28最高工作温度:70 °C
最低工作温度:输出位码:BINARY
输出格式:PARALLEL, 8 BITS封装主体材料:PLASTIC/EPOXY
封装代码:TSSOP封装等效代码:TSSOP28,.25
封装形状:RECTANGULAR封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
峰值回流温度(摄氏度):NOT SPECIFIED电源:3.3 V
认证状态:Not Qualified采样速率:80 MHz
采样并保持/跟踪并保持:SAMPLE座面最大高度:1.2 mm
子类别:Analog to Digital Converters标称供电电压:3.3 V
表面贴装:YES技术:CMOS
温度等级:COMMERCIAL端子形式:GULL WING
端子节距:0.65 mm端子位置:DUAL
处于峰值回流温度下的最长时间:NOT SPECIFIED宽度:4.4 mm

TLV5580CPWR 数据手册

 浏览型号TLV5580CPWR的Datasheet PDF文件第30页浏览型号TLV5580CPWR的Datasheet PDF文件第31页浏览型号TLV5580CPWR的Datasheet PDF文件第32页浏览型号TLV5580CPWR的Datasheet PDF文件第34页浏览型号TLV5580CPWR的Datasheet PDF文件第35页浏览型号TLV5580CPWR的Datasheet PDF文件第36页 
PACKAGE OPTION ADDENDUM  
www.ti.com  
20-Aug-2011  
PACKAGING INFORMATION  
Status (1)  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
TLV5580CDW  
TLV5580CDWG4  
TLV5580CPW  
NRND  
NRND  
NRND  
NRND  
NRND  
NRND  
SOIC  
SOIC  
DW  
DW  
PW  
PW  
DW  
DW  
28  
28  
28  
28  
28  
28  
20  
20  
50  
50  
20  
20  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-1-260C-UNLIM  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
CU NIPDAU Level-1-260C-UNLIM  
TSSOP  
TSSOP  
SOIC  
Green (RoHS  
& no Sb/Br)  
TLV5580CPWG4  
TLV5580IDW  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
TLV5580IDWG4  
SOIC  
Green (RoHS  
& no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
Addendum-Page 1  

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