Source Url Status Check Date: | 2013-06-14 00:00:00 | 是否Rohs认证: | 符合 |
生命周期: | Active | 零件包装代码: | SOIC |
包装说明: | SOP, | 针数: | 8 |
Reach Compliance Code: | compliant | 风险等级: | 1.75 |
JESD-30 代码: | R-PDSO-G8 | JESD-609代码: | e3 |
长度: | 4.9 mm | 湿度敏感等级: | 1 |
功能数量: | 1 | 端子数量: | 8 |
封装主体材料: | PLASTIC/EPOXY | 封装代码: | SOP |
封装形状: | RECTANGULAR | 封装形式: | SMALL OUTLINE |
峰值回流温度(摄氏度): | 260 | 筛选级别: | AEC-Q100 |
座面最大高度: | 1.75 mm | 标称供电电压: | 12 V |
表面贴装: | YES | 电信集成电路类型: | INTERFACE CIRCUIT |
端子面层: | Tin (Sn) | 端子形式: | GULL WING |
端子节距: | 1.27 mm | 端子位置: | DUAL |
处于峰值回流温度下的最长时间: | 30 | 宽度: | 3.9 mm |
Base Number Matches: | 1 |
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