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TIM5964-80SL PDF预览

TIM5964-80SL

更新时间: 2024-01-23 03:18:49
品牌 Logo 应用领域
东芝 - TOSHIBA 微波
页数 文件大小 规格书
4页 158K
描述
MICROWAVE POWER GaAs FET

TIM5964-80SL 技术参数

生命周期:Active包装说明:FLANGE MOUNT, R-CDFM-F2
针数:2Reach Compliance Code:unknown
ECCN代码:EAR99风险等级:5.05
外壳连接:SOURCE配置:SINGLE
最小漏源击穿电压:15 V最大漏极电流 (Abs) (ID):26 A
最大漏极电流 (ID):26 AFET 技术:JUNCTION
最高频带:C BANDJESD-30 代码:R-CDFM-F2
元件数量:1端子数量:2
工作模式:DEPLETION MODE最高工作温度:175 °C
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装形状:RECTANGULAR
封装形式:FLANGE MOUNT极性/信道类型:N-CHANNEL
功耗环境最大值:250 W认证状态:Not Qualified
子类别:Other Transistors表面贴装:YES
端子形式:FLAT端子位置:DUAL
晶体管应用:AMPLIFIER晶体管元件材料:GALLIUM ARSENIDE
Base Number Matches:1

TIM5964-80SL 数据手册

 浏览型号TIM5964-80SL的Datasheet PDF文件第1页浏览型号TIM5964-80SL的Datasheet PDF文件第3页浏览型号TIM5964-80SL的Datasheet PDF文件第4页 
TIM5964-80SL  
ABSOLUTE MAXIMUM RATINGS ( Ta= 25 C )  
°
CHARACTERISTICS  
Drain-Source Voltage  
SYMBOL  
VDS  
VGS  
IDS  
UNIT  
V
RATING  
15  
-5  
Gate-Source Voltage  
Drain Current  
V
A
26  
Total Power Dissipation (Tc= 25 C)  
PT  
W
250  
°
C
Channel Temperature  
Storage Temperature  
Tch  
175  
°
C
°
Tstg  
-65 to +175  
PACKAGE OUTLINE (7-AA02C)  
Unit in mm  
(1) Gate  
(2) Source  
(3) Drain  
HANDLING PRECAUTIONS FOR PACKAGE MODEL  
Soldering iron should be grounded and the operating time should not exceed 10 seconds  
at 260°C.  
2

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