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TIBPAL20R4-10MWB PDF预览

TIBPAL20R4-10MWB

更新时间: 2024-11-03 15:54:19
品牌 Logo 应用领域
罗彻斯特 - ROCHESTER 时钟输入元件可编程逻辑
页数 文件大小 规格书
28页 667K
描述
OT PLD, 10ns, TTL, CDFP24, CERAMIC, DFP-24

TIBPAL20R4-10MWB 技术参数

生命周期:Contact Manufacturer包装说明:DFP,
Reach Compliance Code:unknownECCN代码:3A001.A.2.C
HTS代码:8542.39.00.01风险等级:5.68
最大时钟频率:50 MHzJESD-30 代码:R-GDFP-F24
长度:14.355 mm专用输入次数:12
I/O 线路数量:4端子数量:24
最高工作温度:125 °C最低工作温度:-55 °C
组织:12 DEDICATED INPUTS, 4 I/O输出函数:MIXED
封装主体材料:CERAMIC, GLASS-SEALED封装代码:DFP
封装形状:RECTANGULAR封装形式:FLATPACK
可编程逻辑类型:OT PLD传播延迟:10 ns
座面最大高度:2.29 mm最大供电电压:5.5 V
最小供电电压:4.5 V标称供电电压:5 V
表面贴装:YES技术:TTL
温度等级:MILITARY端子形式:FLAT
端子节距:1.27 mm端子位置:DUAL
宽度:9.085 mmBase Number Matches:1

TIBPAL20R4-10MWB 数据手册

 浏览型号TIBPAL20R4-10MWB的Datasheet PDF文件第2页浏览型号TIBPAL20R4-10MWB的Datasheet PDF文件第3页浏览型号TIBPAL20R4-10MWB的Datasheet PDF文件第4页浏览型号TIBPAL20R4-10MWB的Datasheet PDF文件第5页浏览型号TIBPAL20R4-10MWB的Datasheet PDF文件第6页浏览型号TIBPAL20R4-10MWB的Datasheet PDF文件第7页 
OBSOLETE - No Longer Available  
TIBPAL20L8-7C, TIBPAL20R4-7C, TIBPAL20R6-7C, TIBPAL20R8-7C  
TIBPAL20L8-10M, TIBPAL20R4-10M, TIBPAL20R6-10M, TIBPAL20R8-10M  
HIGH-PERFORMANCE IMPACT-XꢀPAL® CIRCUITS  
SRPS005E D3307, OCTOBER 1989 REVISED DECEMBER 2010  
TIBPAL20L8’  
C SUFFIX . . . JT OR NT PACKAGE  
M SUFFIX . . . JT PACKAGE  
High-Performance Operation:  
f
f
f
(no feedback)  
max  
TIBPAL20R’ -7C Series . . . 100 MHz  
TIBPAL20R’ -10M Series . . . 62.5 MHz  
(TOP VIEW)  
(internal feedback)  
max  
I
I
I
I
I
I
I
I
VCC  
I
O
I/O  
I/O  
I/O  
I/O  
I/O  
I/O  
O
1
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
TIBPAL20R-7C Series . . . 100 MHz  
TIBPAL20R-10M Series . . . 62.5 MHz  
2
3
(external feedback)  
max  
4
TIBPAL20R’ -7C Series . . . 74 MHz  
TIBPAL20R’ -10M Series . . . 50 MHz  
Propagation Delay  
5
6
7
TIBPAL20L8-7C Series . . . 7 ns Max  
TIBPAL20L8-10M Series . . . 10 ns Max  
8
I
I
I
9
10  
11  
12  
Functionally Equivalent, but Faster Than  
I
I
Existing 24-Pin PLD Circuits  
GND  
Preload Capability on Output Registers  
Simplifies Testing  
TIBPAL20L8’  
Power-Up Clear on Registered Devices (All  
Register Outputs are Set Low, but Voltage  
Levels at the Output Pins Go High)  
C SUFFIX . . . FN PACKAGE  
M SUFFIX . . . FK PACKAGE  
(TOP VIEW)  
Package Options Include Both Plastic and  
Ceramic Chip Carriers in Addition to Plastic  
and Ceramic DIPs  
4
3
2
1
28 27 26  
25  
5
6
7
8
9
I
I
I
I/O  
I/O  
I/O  
Security Fuse Prevents Duplication  
24  
23  
Dependable Texas Instruments Quality and  
Reliability  
NC  
22 NC  
21 I/O  
20 I/O  
19 I/O  
I
I
I
I/O  
PORT  
S
I
3-STATE  
REGISTERED  
Q OUTPUTS  
10  
11  
DEVICE  
INPUTS O OUTPUTS  
PAL20L8  
PAL20R4  
PAL20R6  
PAL20R8  
14  
12  
12  
12  
2
0
0
0
0
6
4
2
0
12 13 14 15 16 17 18  
4 (3-state buffers)  
6 (3-state buffers)  
8 (3-state buffers)  
NC No internal connection  
Pin assignments in operating mode  
description  
These programmable array logic devices feature high speed and functional equivalency when compared with  
currently available devices. These IMPACT-Xcircuits combine the latest Advanced Low-Power Schottky  
technology with proven titanium-tungsten fuses to provide reliable, high-performance substitutes for  
conventional TTL logic. Their easy programmability allows for quick design of custom functions and typically  
results in a more compact circuit board. In addition, chip carriers are available for futher reduction in board  
space.  
All of the register outputs are set to a low level during power-up. Extra circuitry has been provided to allow loading  
of each register asynchronously to either a high or low state. This feature simplifies testing because the registers  
can be set to an initial state prior to executing the test sequence.  
The TIBPAL20’ C series is characterized from 0°C to 75°C. The TIBPAL20’ M series is characterized for  
operation over the full military temperature range of 55°C to 125°C.  
IMPACT-X is a trademark of Texas Instruments Incorporated.  
PAL is a registered trademark of Advanced Micro Devices Inc.  
PRODUCTION DATA information is current as of publication date. Products  
Copyright © 2010, Texas Instruments Incorporated  
conform to specifications per the terms of Texas Instruments standard  
warranty. Production processing does not necessarily include testing of all  
parameters.  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
1

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