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TFA9878BUK/N1 PDF预览

TFA9878BUK/N1

更新时间: 2024-11-14 21:16:11
品牌 Logo 应用领域
恩智浦 - NXP /
页数 文件大小 规格书
28页 327K
描述
Audio/Video Amplifier

TFA9878BUK/N1 技术参数

生命周期:Active包装说明:,
Reach Compliance Code:unknown风险等级:5.73
Base Number Matches:1

TFA9878BUK/N1 数据手册

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TFA9878_SDS  
High Efficiency Class-D Audio Amplifier  
Rev. 2 — 5 November 2019  
Product data sheet  
1 General description  
The TFA9878 is a high efficiency 10.0 V boosted class-D audio amplifier. It can deliver  
up to 10.0 W peak output power into an 8 Ω speaker and up to 11.8 W peak output  
power into a 6 Ω speaker, at a supply voltage of 4.0 V. The internal adaptive DC-to-DC  
converter raises the supply voltage up to 10.0 V, providing ample headroom for major  
improvements in sound quality.  
Internal adaptive DC-to-DC conversion boosts the supply rail to provide additional  
headroom and power output. The supply voltage is only raised when necessary,  
maximizing the output power of the class-D audio amplifier while limiting quiescent power  
consumption.  
The device can be configured to drive either a hands-free speaker (4 Ω to 8 Ω) for audio  
playback or a receiver speaker (32 Ω), for handset playback. So, it can be embedded in  
platforms supporting both a hands-free speaker and a handset speaker. The maximum  
output power and the noise levels are lower in handset call use case than in hands-free  
call use case.  
The TFA9878 also incorporates battery protection. By limiting the supply current when  
the battery voltage is low, it prevents the audio system from drawing excessive load  
currents from the battery, which could cause a system under voltage. This circuitry  
minimizes the impact of a falling battery voltage by preventing unexpected device switch  
off due to excessive current drawn from the battery.  
The device contains MIPI v 1.1 compliant SoundWire interface which is used for audio  
data and control communication with the audio host. Furthermore, it can be used in  
legacy mode where TDM is used as audio interface and I2C used for controlling the  
device.  
The TFA9878 is available in a 36-bump wafer level chip-size package (WLCSP) with a  
400 μm pitch.  
 

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