N-Channel Enhancement Mode MOSFET
TBL055N085TH
Thermal Characteristics
Parameter
Power Dissipation (TC = 25°C)
Symbol
PD
Value
174
Unit
W
Thermal Resistance Junction-to-Air
Thermal Resistance Junction-to-Case
Operating Junction Temperature Range
Storage Temperature Range
RθJA
RθJC
TJ
62
°C /W
°C /W
°C
0.72
-55 to +150
-55 to +150
TSTG
°C
Electrical Characteristics (@ TJ = 25℃ unless otherwise specified)
Symbol
Parameter
Test Condition
Min. Typ. Max. Unit
Static Characteristics
VDSS
IDSS
IGSS
Drain-Source Breakdown Voltage
VGS = 0V, ID = 250μA
85
-
-
V
VDS = 85V, VGS = 0V, TJ=25°C
VDS = 85V, VGS = 0V, TJ=125°C
-
-
0.25
-
1
5
Zero Gate Voltage Drain Current
Gate-Body Leakage Current
μA
nA
VGS = ±20V, VDS = 0V
-
-
±1 00
On Characteristics
RDS(ON)
VGS(th)
gfs
Static Drain-Source On-resistance
VGS = 10V,ID = 40A
VDS = VGS, ID = 250μA
VDS =5V, ID =50A
-
2
-
4.6
2.5
51
5.5
4
mΩ
V
Gate Threshold Voltage
Transconductance
-
S
Dynamic Characteristics
CISS
COSS
CRSS
Input Capacitance
-
-
-
4329
637
80
-
-
-
VGS = 0V
Output Capacitance
VDS = 40V
f = 1.0MHz
pF
Reverse Transfer Capacitance
Switching Characteristics
td(ON)
tr
td(OFF)
tf
Turn-on Delay Time
Turn-on Rise Time
-
-
-
-
-
-
-
20.1
38.9
45.1
22.8
65
-
-
-
-
-
-
-
VDD = 40V
RG = 3Ω
ns
Turn-Off Delay Time
Turn-Off Fall Time
VGS = 10V
QG
Total Gate-Charge
VDD = 40V, VGS=10V
ID=50A, f = 1.0MHz
QGS
QGD
Gate to Source Charge
Gate to Drain ( “Miller” ) Charge
24
nC
13
Source-Drain Diode Characteristics
VSD
trr
Diode Forward Voltage
ISD = 40A, VGS = 0V
-
-
0.9
60
1.4
-
V
Body Diode Reverse Recovery Time
ns
IF=20A, dI / dt=500A/μs
Body Diode Reverse Recovery
Charge
Qrr
-
560
-
nC
MTM0941A: November 2020
www.gmesemi.com
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