Datasheet > TB2S

TB2S

更新时间： 2024-09-15 07:17:55

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上华 - COMCHIP		/
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4页	96K
描述
Silicon Bridge Rectifiers

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中文翻译

获取价格

数据手册

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TB2S 数据手册

Silicon Bridge Rectifiers

TB2S-G Thru. TB10S-G

Reverse Voltage: 200 to 1000 Volts

Forward Current: 0.8,1.0 A

RoHS Device

Features

TBS

-Glass passivated chip junction.

0.028 (0.70)

0.024 (0.60)

-High surge overload rating :30A peak

-Save space on printed circuit boards.

0.179 (4.55)

0.167 (4.25)

-High temperature soldering guaranteed:

260°C/10 seconds at 5 ibs.

0.012 (0.30)

0.008 (0.20)

-Pb free product.

0.264 (6.70)

0.249 (6.30)

0.161 (4.10)

0.154 (3.90)

-Plastic materrial has U/L flammability classification 94v-0.

0.006 (0.15)

0.002 (0.05)

Mechanical data

0.205 (5.20)

0.189 (4.80)

0.060 (1.45)

0.051 (1.15)

-Polarity: Symbol molded on body.

-Case: Molded plastic body over passivated junction.

-Terminals: Plated leads solderable per MIL-STD-750,

Method 2026.

0.028 (0.70)

0.024 (0.60)

Dimensions in inches and (millimeter)

-Mounting position: Any.

Maximum ratings and electrical characteristics

Rating at 25°C ambient temperature unless otherwise specified.

Single phase, half wave ,60Hz, resistive or inductive load.

For capacitive load, derate current by 20%

Symbol

Marking

TB2S-G

TB2S

200

TB4S-G

TB4S

400

TB6S-G

TB6S

600

TB8S-G

TB8S

800

TB10S-G

TB10S

1000

Parameter

Unit

Maximum Recurrent Peak Reverse Voltage

Maximum RMS Voltage

VRRM

VRMS

VDC

140

200

280

400

420

600

560

800

700

1000

Maximum DC Blocking Voltage

0.8¹⁾

1.0²⁾

Maximum Average Forward Output Current

TL=100°C

IF(AV)

IFSM

Peak Forward Surge Current, 8.3ms Single

Half Sine-wave, Superimposed on Rated Load

(JEDEC Method)

Maximum Instantaneous Forward Voltage

at 0.4A DC

0.95

Maximum Reverse Current @TA=25°C

at Rated DC Blocking Voltage

μA

Typical Thermal Junction to lead

On aluminum substrate

On glass-epoxy substrate

RθJL

RθJA

62.5

°C/W

-55 to +150

°C

Operating Junction Temperature Range

Storage Temperature Range

TSTG

Notes: 1. On glass epoxy P.C.B

2. On aluminum substrate

REV:A

Page 1

QW-BBR53

Comchip Technology CO., LTD.

12 3 4

中文翻译

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