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SZMMBZ5266BLT1G PDF预览

SZMMBZ5266BLT1G

更新时间： 2024-11-24 15:53:19
品牌 Logo 应用领域
安森美 - ONSEMI 测试光电二极管
页数 文件大小 规格书
6页 118K
描述
DIODE 68 V, 0.225 W, SILICON, UNIDIRECTIONAL VOLTAGE REGULATOR DIODE, TO-236AB, HALOGEN FREE AND ROHS COMPLIANT, PLASTIC, CASE 318-08, TO-236, 3 PIN, Voltage Regulator Diode

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SZMMBZ5266BLT1G 技术参数

是否无铅：不含铅是否Rohs认证：符合
生命周期：Obsolete包装说明：R-PDSO-G3
Reach Compliance Code：compliantECCN代码：EAR99
HTS代码：8541.10.00.50风险等级：5.84
Is Samacsys：N配置：SINGLE
二极管元件材料：SILICON二极管类型：ZENER DIODE
JEDEC-95代码：TO-236ABJESD-30 代码：R-PDSO-G3
JESD-609代码：e3湿度敏感等级：1
元件数量：1端子数量：3
最高工作温度：150 °C最低工作温度：-65 °C
封装主体材料：PLASTIC/EPOXY封装形状：RECTANGULAR
封装形式：SMALL OUTLINE峰值回流温度（摄氏度）：NOT SPECIFIED
极性：UNIDIRECTIONAL最大功率耗散：0.225 W
参考标准：AEC-Q101标称参考电压：68 V
表面贴装：YES技术：ZENER
端子面层：Tin (Sn)端子形式：GULL WING
端子位置：DUAL处于峰值回流温度下的最长时间：NOT SPECIFIED
最大电压容差：5%工作测试电流：1.8 mA
Base Number Matches：1

SZMMBZ5266BLT1G 数据手册

 浏览型号SZMMBZ5266BLT1G的Datasheet PDF文件第2页浏览型号SZMMBZ5266BLT1G的Datasheet PDF文件第3页浏览型号SZMMBZ5266BLT1G的Datasheet PDF文件第4页浏览型号SZMMBZ5266BLT1G的Datasheet PDF文件第5页浏览型号SZMMBZ5266BLT1G的Datasheet PDF文件第6页 
MMBZ52xxBLT1G Series,  
SZMMBZ52xxBLT1G Series  
Zener Voltage Regulators  
225 mW SOT−23 Surface Mount  
This series of Zener diodes is offered in the convenient, surface  
mount plastic SOT−23 package. These devices are designed to provide  
voltage regulation with minimum space requirement. They are well  
suited for applications such as cellular phones, hand held portables,  
and high density PC boards.  
http://onsemi.com  
Features  
• 225 mW Rating on FR−4 or FR−5 Board  
• Zener Voltage Range − 2.4 V to 91 V  
• Package Designed for Optimal Automated Board Assembly  
• Small Package Size for High Density Applications  
• ESD Rating of Class 3 (> 16 KV) per Human Body Model  
SOT−23  
CASE 318  
STYLE 8  
• SZ Prefix for Automotive and Other Applications Requiring Unique  
Site and Control Change Requirements; AEC−Q101 Qualified and  
PPAP Capable  
3
1
Cathode  
Anode  
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS  
MARKING DIAGRAM  
Compliant*  
Mechanical Characteristics  
xxx  
G
CASE: Void-free, transfer-molded, thermosetting plastic case  
FINISH: Corrosion resistant finish, easily solderable  
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:  
260°C for 10 Seconds  
POLARITY: Cathode indicated by polarity band  
FLAMMABILITY RATING: UL 94 V−0  
G
xxx  
M
G
= Specific Device Code  
= Date Code  
= Pb−Free Package  
(Note: Microdot may be in either location)  
MAXIMUM RATINGS  
Rating  
Symbol  
Max  
Units  
ORDERING INFORMATION  
Total Power Dissipation on FR−5 Board,  
P
D
†
Device  
Package  
Shipping  
(Note 1) @ T = 25°C  
225  
1.8  
mW  
mW/°C  
A
MMBZ52xxBLT1G  
SOT−23  
(Pb−Free)  
3,000 /  
Derated above 25°C  
Tape & Reel  
Thermal Resistance,  
Junction−to−Ambient  
R
556  
°C/W  
q
JA  
SZMMBZ52xxBLT1G SOT−23  
(Pb−Free)  
3,000 /  
Tape & Reel  
Total Power Dissipation on Alumina  
P
D
MMBZ52xxBLT3G  
SOT−23  
(Pb−Free)  
10,000 /  
Substrate, (Note 2) @ T = 25°C  
300  
2.4  
mW  
mW/°C  
A
Tape & Reel  
Derated above 25°C  
SZMMBZ52xxBLT3G SOT−23  
(Pb−Free)  
10,000 /  
Tape & Reel  
Thermal Resistance,  
Junction−to−Ambient  
R
417  
°C/W  
q
JA  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Junction and Storage  
Temperature Range  
T , T  
−65 to +150  
°C  
J
stg  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. FR−5 = 1.0 X 0.75 X 0.62 in.  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking  
column of the Electrical Characteristics table on page 3 of  
this data sheet.  
2. Alumina = 0.4 X 0.3 X 0.024 in, 99.5% alumina.  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
© Semiconductor Components Industries, LLC, 2013  
1
Publication Order Number:  
March, 2013 − Rev. 12  
MMBZ5221BLT1/D  
 
123456

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