Datasheet > SZMMBZ52xxBLT3G

SZMMBZ52xxBLT3G

更新时间： 2024-11-24 12:14:23

品牌	Logo	应用领域
安森美 - ONSEMI		稳压器
页数	文件大小	规格书
6页	172K
描述
Zener Voltage Regulators

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中文翻译

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数据手册

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SZMMBZ52xxBLT3G 数据手册

MMBZ52xxBLT1G Series,

SZMMBZ52xxBLT1G Series

Zener Voltage Regulators

225 mW SOT−23 Surface Mount

This series of Zener diodes is offered in the convenient, surface

mount plastic SOT−23 package. These devices are designed to provide

voltage regulation with minimum space requirement. They are well

suited for applications such as cellular phones, hand held portables,

and high density PC boards.

http://onsemi.com

Features

 225 mW Rating on FR−4 or FR−5 Board

 Zener Voltage Range − 2.4 V to 91 V

 Package Designed for Optimal Automated Board Assembly

 Small Package Size for High Density Applications

 ESD Rating of Class 3 (> 16 KV) per Human Body Model

SOT−23

CASE 318

STYLE 8

 SZ Prefix for Automotive and Other Applications Requiring Unique

Site and Control Change Requirements; AEC−Q101 Qualified and

PPAP Capable

Cathode

Anode

MARKING DIAGRAM

 Pb−Free Packages are Available*

Mechanical Characteristics

CASE: Void-free, transfer-molded, thermosetting plastic case

FINISH: Corrosion resistant finish, easily solderable

MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:

260C for 10 Seconds

POLARITY: Cathode indicated by polarity band

FLAMMABILITY RATING: UL 94 V−0

xxx

= Specific Device Code

= Date Code

= Pb−Free Package

(Note: Microdot may be in either location)

MAXIMUM RATINGS

Rating

Symbol

Max

Units

ORDERING INFORMATION

Total Power Dissipation on FR−5 Board,

†

Device

Package

Shipping

(Note 1) @ T = 25C

225

1.8

mW/C

MMBZ52xxBLT1G

SOT−23

(Pb−Free)

3,000 /

Derated above 25C

Tape & Reel

Thermal Resistance,

Junction−to−Ambient

556

C/W

SZMMBZ52xxBLT1G SOT−23

(Pb−Free)

3,000 /

Tape & Reel

Total Power Dissipation on Alumina

MMBZ52xxBLT3G

SOT−23

(Pb−Free)

10,000 /

Substrate, (Note 2) @ T = 25C

300

2.4

mW/C

Tape & Reel

Derated above 25C

SZMMBZ52xxBLT3G SOT−23

(Pb−Free)

10,000 /

Tape & Reel

Thermal Resistance,

Junction−to−Ambient

417

C/W

C

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

Junction and Storage

Temperature Range

T , T

−65 to +150

stg

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. FR−5 = 1.0 X 0.75 X 0.62 in.

DEVICE MARKING INFORMATION

See specific marking information in the device marking

column of the Electrical Characteristics table on page 3 of

this data sheet.

2. Alumina = 0.4 X 0.3 X 0.024 in, 99.5% alumina.

*For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

 Semiconductor Components Industries, LLC, 2012

Publication Order Number:

February, 2012 − Rev. 11

MMBZ5221BLT1/D

12 3 4 5 6

中文翻译

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