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SZMMBZH33VAWT1G PDF预览

SZMMBZH33VAWT1G

更新时间: 2024-11-24 20:02:47
品牌 Logo 应用领域
安森美 - ONSEMI 二极管
页数 文件大小 规格书
5页 109K
描述
Rectifier Diode

SZMMBZH33VAWT1G 技术参数

是否Rohs认证: 符合生命周期:Active
Reach Compliance Code:compliant风险等级:5.76
二极管类型:RECTIFIER DIODE峰值回流温度(摄氏度):NOT SPECIFIED
处于峰值回流温度下的最长时间:NOT SPECIFIEDBase Number Matches:1

SZMMBZH33VAWT1G 数据手册

 浏览型号SZMMBZH33VAWT1G的Datasheet PDF文件第2页浏览型号SZMMBZH33VAWT1G的Datasheet PDF文件第3页浏览型号SZMMBZH33VAWT1G的Datasheet PDF文件第4页浏览型号SZMMBZH33VAWT1G的Datasheet PDF文件第5页 
MMBZHxxVAWT1G Series,  
SZMMBZHxxVAWT1G Series  
Diodes, Dual 40 Watt Peak  
Power, High Temperature  
SC70 Dual Common Anode Zeners  
www.onsemi.com  
These dual monolithic silicon Zener diodes are designed for  
applications requiring transient overvoltage protection capability. They  
are intended for use in voltage and ESD sensitive equipment such as  
computers, printers, business machines, communication systems,  
medical equipment and other applications. Their dual junction common  
anode design protects two separate lines using only one package. These  
devices are high temperature rated and ideal for use in high reliability  
applications where board space is at a premium.  
SC70  
CASE 419  
STYLE 4  
Features  
CATHODE 1  
CATHODE 2  
3 ANODE  
SC70 Package Allows Either Two Separate Unidirectional  
Configurations or a Single Bidirectional Configuration  
Standard Zener Breakdown Voltage Range: 15 33 V  
Peak Power 40 W @ 1.0 ms (Unidirectional),  
MARKING DIAGRAM  
per Figure 5 Waveform  
ESD Rating:  
Class 3B (> 16 kV) per the Human Body Model  
Class C (> 400 V) per the Machine Model  
XX MG  
G
Low Leakage < 5.0 mA  
1
Flammability Rating UL 94 V0  
XX = Specific Device Code  
175°C T  
Rated for High Temperature, Mission Critical  
J(MAX)  
Applications  
M
G
= Date Code  
= PbFree Package  
(Note: Microdot may be in either location)  
SZ Prefix for Automotive and Other Applications Requiring Unique  
Site and Control Change Requirements  
These are PbFree Devices*  
ORDERING INFORMATION  
Mechanical Characteristics:  
Device  
Package  
Shipping  
CASE: Void-free, transfer-molded, thermosetting plastic case  
FINISH: Corrosion resistant finish, easily solderable  
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:  
260°C for 10 Seconds  
Package designed for optimal automated board assembly  
Small package size for high density applications  
Available in 8 mm Tape and Reel  
MMBZHxxVAWT1G  
SC70  
(PbFree)  
3,000 /  
Tape & Reel  
SZMMBZHxxVAWT1G  
SC70  
(PbFree)  
3,000 /  
Tape & Reel  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Use the Device Number to order the 7 inch/3,000 unit reel.  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking  
column of the table on page 2 of this data sheet.  
© Semiconductor Components Industries, LLC, 2018  
1
Publication Order Number:  
December, 2018 Rev. 0  
MMBZH27VAW/D  

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