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SZMMSZ11ET1G PDF预览

SZMMSZ11ET1G

更新时间： 2024-11-02 15:53:19
品牌 Logo 应用领域
安森美 - ONSEMI 测试光电二极管
页数 文件大小 规格书
6页 171K
描述
DIODE VOLTAGE REGULATOR DIODE, Voltage Regulator Diode

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中文翻译

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SZMMSZ11ET1G 技术参数

是否Rohs认证：符合生命周期：Active
包装说明：R-PDSO-G2Reach Compliance Code：compliant
ECCN代码：EAR99HTS代码：8541.10.00.50
风险等级：5.79Is Samacsys：N
配置：SINGLE二极管元件材料：SILICON
二极管类型：ZENER DIODEJESD-30 代码：R-PDSO-G2
元件数量：1端子数量：2
最高工作温度：150 °C最低工作温度：-55 °C
封装主体材料：PLASTIC/EPOXY封装形状：RECTANGULAR
封装形式：SMALL OUTLINE峰值回流温度（摄氏度）：NOT SPECIFIED
极性：UNIDIRECTIONAL最大功率耗散：0.5 W
参考标准：AEC-Q101标称参考电压：11 V
表面贴装：YES技术：ZENER
端子形式：GULL WING端子位置：DUAL
处于峰值回流温度下的最长时间：NOT SPECIFIED最大电压容差：5%
工作测试电流：5 mABase Number Matches：1

SZMMSZ11ET1G 数据手册

 浏览型号SZMMSZ11ET1G的Datasheet PDF文件第2页浏览型号SZMMSZ11ET1G的Datasheet PDF文件第3页浏览型号SZMMSZ11ET1G的Datasheet PDF文件第4页浏览型号SZMMSZ11ET1G的Datasheet PDF文件第5页浏览型号SZMMSZ11ET1G的Datasheet PDF文件第6页 
MMSZxxxET1G Series,  
SZMMSZxxxET1G Series  
Zener Voltage Regulators  
500 mW SOD−123 Surface Mount  
Three complete series of Zener diodes are offered in the convenient,  
surface mount plastic SOD−123 package. These devices provide a  
convenient alternative to the leadless 34−package style.  
http://onsemi.com  
Specification Features  
500 mW Rating on FR−4 or FR−5 Board  
Wide Zener Reverse Voltage Range − 2.4 V to 56 V  
Package Designed for Optimal Automated Board Assembly  
Small Package Size for High Density Applications  
ESD Rating of Class 3 (> 16 kV) per Human Body Model  
Peak Power − 225 W (8 X 20 ms)  
AEC−Q101 Qualified and PPAP Capable  
SZ Prefix for Automotive and Other Applications Requiring Unique  
Site and Control Change Requirements  
SOD−123  
CASE 425  
STYLE 1  
1
2
Cathode  
Anode  
MARKING DIAGRAM  
Pb−Free Packages are Available*  
Mechanical Characteristics  
xxx MG  
CASE: Void-free, transfer-molded, thermosetting plastic case  
FINISH: Corrosion resistant finish, easily solderable  
MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:  
260C for 10 Seconds  
POLARITY: Cathode indicated by polarity band  
FLAMMABILITY RATING: UL 94 V−0  
1
G
xxx = Device Code  
M
G
= Date Code  
= Pb−Free Package  
(Note: Microdot may be in either location)  
MAXIMUM RATINGS  
Rating  
Symbol  
Max  
Unit  
ORDERING INFORMATION  
Peak Power Dissipation @ 20 ms (Note 1)  
P
W
†
pk  
Device  
Package  
Shipping  
@ T 25C  
225  
L
MMSZxxxET1G  
SOD−123  
(Pb−Free)  
3,000 /  
Total Power Dissipation on FR−5 Board,  
P
D
Tape & Reel  
(Note 2) @ T = 75C  
500  
6.7  
mW  
mW/C  
L
SZMMSZxxxET1G SOD−123  
(Pb−Free)  
3,000 /  
Derated above 75C  
Tape & Reel  
Thermal Resistance, Junction−to−Ambient  
(Note 3)  
R
340  
C/W  
C/W  
C  
q
JA  
MMSZxxxET3G  
SOD−123  
(Pb−Free)  
10,000 /  
Tape & Reel  
Thermal Resistance, Junction−to−Lead  
(Note 3)  
R
q
JL  
150  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Junction and Storage Temperature Range T , T  
−55 to +150  
J
stg  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
1. Nonrepetitive current pulse per Figure 11  
2. FR−5 = 3.5 X 1.5 inches, using the ON minimum recommended footprint  
3. Thermal Resistance measurement obtained via infrared Scan Method  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking  
column of the Electrical Characteristics table on page 2 of  
this data sheet.  
*For additional information on our Pb−Free strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
Semiconductor Components Industries, LLC, 2012  
1
Publication Order Number:  
January, 2012 − Rev. 7  
MMSZ2V4ET1/D  
 
123456

中文翻译

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