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SZMM5Z3V9T1G PDF预览

SZMM5Z3V9T1G

更新时间: 2024-11-15 11:01:39
品牌 Logo 应用领域
安森美 - ONSEMI 测试光电二极管
页数 文件大小 规格书
4页 102K
描述
Zener Diode, 500 mW 3.9 V ±5% SOD-523 Package

SZMM5Z3V9T1G 技术参数

是否无铅: 不含铅生命周期:Active
包装说明:SOD-523, 2 PINReach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.10.00.50
Factory Lead Time:15 weeks风险等级:1.26
Samacsys Description:Zener Diodes SOD-523 EUT SNGL PB配置:SINGLE
二极管元件材料:SILICON二极管类型:ZENER DIODE
最大动态阻抗:90 Ω最大正向电压 (VF):0.9 V
JESD-30 代码:R-PDSO-F2JESD-609代码:e3
膝阻抗最大值:1000 Ω湿度敏感等级:1
元件数量:1端子数量:2
最高工作温度:150 °C最低工作温度:-65 °C
封装主体材料:PLASTIC/EPOXY封装形状:RECTANGULAR
封装形式:SMALL OUTLINE峰值回流温度(摄氏度):260
极性:UNIDIRECTIONAL最大功率耗散:0.5 W
参考标准:AEC-Q101标称参考电压:3.9 V
最大反向电流:3 µA反向测试电压:1 V
表面贴装:YES技术:ZENER
端子面层:Tin (Sn)端子形式:FLAT
端子位置:DUAL处于峰值回流温度下的最长时间:NOT SPECIFIED
最大电压容差:5.13%工作测试电流:5 mA

SZMM5Z3V9T1G 数据手册

 浏览型号SZMM5Z3V9T1G的Datasheet PDF文件第2页浏览型号SZMM5Z3V9T1G的Datasheet PDF文件第3页浏览型号SZMM5Z3V9T1G的Datasheet PDF文件第4页 
MM5ZxxxT1G Series,  
SZMM5ZxxxT1G Series  
Zener Voltage Regulators  
300 mW SOD523 Surface Mount  
This series of Zener diodes is packaged in a SOD523 surface  
mount package. They are designed to provide voltage regulation  
protection and are especially attractive in situations where space is at a  
premium. They are well suited for applications such as cellular  
phones, hand held portables, and high density PC boards.  
http://onsemi.com  
SOD523  
CASE 502  
STYLE 1  
Specification Features:  
Standard Zener Breakdown Voltage Range 2.4 V to 75 V  
Steady State Power Rating of 300 mW  
Small Body Outline Dimensions:  
0.047x 0.032(1.20 mm x 0.80 mm)  
1
2
Low Body Height: 0.028(0.7 mm)  
ESD Rating of Class 3 (> 16 kV) per Human Body Model  
Cathode  
Anode  
AECQ101 Qualified and PPAP Capable SZMM5ZxxxT1G  
SZ Prefix for Automotive and Other Applications Requiring Unique  
Site and Control Change Requirements  
These are PbFree Devices*  
MARKING DIAGRAM  
XX M G  
G
2
1
Mechanical Characteristics:  
CASE: Void-free, transfer-molded, thermosetting plastic  
Epoxy Meets UL 94 V0  
LEAD FINISH: 100% Matte Sn (Tin)  
MOUNTING POSITION: Any  
XX = Specific Device Code  
M
= Date Code*  
G
= PbFree Package  
(Note: Microdot may be in either location)  
*Date Code orientation may vary depending  
upon manufacturing location.  
QUALIFIED MAX REFLOW TEMPERATURE: 260°C  
Device Meets MSL 1 Requirements  
ORDERING INFORMATION  
MAXIMUM RATINGS  
Device  
Package  
Shipping  
Rating  
Symbol  
Max  
Unit  
MM5ZxxxxT1G  
SOD523  
(PbFree)  
3,000 /  
Tape & Reel  
Total Device Dissipation FR5 Board,  
P
D
300  
mW  
@ T = 25°C  
A
SZMM5ZxxxT1G SOD523  
(PbFree)  
3,000 /  
Tape & Reel  
Thermal Resistance,  
R
390  
°C/W  
°C  
q
JA  
JunctiontoAmbient (Note 1)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Junction and Storage  
Temperature Range  
T , T  
J
65 to +150  
stg  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking  
column of the Electrical Characteristics tables starting on  
page 3 of this data sheet.  
1. EIA/JEDEC51.3 board design and EIA/JEDEC51.2 still air test method  
2
(25 mm , 2 oz., 3.8 mm plating).  
*For additional information on our PbFree strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
©
Semiconductor Components Industries, LLC, 2013  
1
Publication Order Number:  
April, 2013 Rev. 10  
MM5Z2V4T1/D  
 

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