Datasheet > SZMM5Z3V9T5G

SZMM5Z3V9T5G

更新时间： 2024-11-15 11:01:39

品牌	Logo	应用领域
安森美 - ONSEMI		/
页数	文件大小	规格书
4页	102K
描述
Zener Diode, 500 mW 3.9 V ±5% SOD-523 Package

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SZMM5Z3V9T5G 数据手册

MM5ZxxxT1G Series,

SZMM5ZxxxT1G Series

Zener Voltage Regulators

300 mW SOD−523 Surface Mount

This series of Zener diodes is packaged in a SOD−523 surface

mount package. They are designed to provide voltage regulation

protection and are especially attractive in situations where space is at a

premium. They are well suited for applications such as cellular

phones, hand held portables, and high density PC boards.

http://onsemi.com

SOD−523

CASE 502

STYLE 1

Specification Features:

• Standard Zener Breakdown Voltage Range − 2.4 V to 75 V

• Steady State Power Rating of 300 mW

• Small Body Outline Dimensions:

0.047″ x 0.032″ (1.20 mm x 0.80 mm)

• Low Body Height: 0.028″ (0.7 mm)

• ESD Rating of Class 3 (> 16 kV) per Human Body Model

Cathode

Anode

• AEC−Q101 Qualified and PPAP Capable − SZMM5ZxxxT1G

• SZ Prefix for Automotive and Other Applications Requiring Unique

Site and Control Change Requirements

• These are Pb−Free Devices*

MARKING DIAGRAM

XX M G

Mechanical Characteristics:

CASE: Void-free, transfer-molded, thermosetting plastic

Epoxy Meets UL 94 V−0

LEAD FINISH: 100% Matte Sn (Tin)

MOUNTING POSITION: Any

XX = Specific Device Code

= Date Code*

= Pb−Free Package

(Note: Microdot may be in either location)

*Date Code orientation may vary depending

upon manufacturing location.

QUALIFIED MAX REFLOW TEMPERATURE: 260°C

Device Meets MSL 1 Requirements

ORDERING INFORMATION

MAXIMUM RATINGS

†

Device

Package

Shipping

Rating

Symbol

Max

Unit

MM5ZxxxxT1G

SOD−523

(Pb−Free)

3,000 /

Tape & Reel

Total Device Dissipation FR−5 Board,

300

@ T = 25°C

SZMM5ZxxxT1G SOD−523

(Pb−Free)

3,000 /

Tape & Reel

Thermal Resistance,

390

°C/W

°C

Junction−to−Ambient (Note 1)

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

Junction and Storage

Temperature Range

T , T

−65 to +150

stg

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

DEVICE MARKING INFORMATION

See specific marking information in the device marking

column of the Electrical Characteristics tables starting on

page 3 of this data sheet.

1. EIA/JEDEC51.3 board design and EIA/JEDEC51.2 still air test method

(25 mm , 2 oz., 3.8 mm plating).

*For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

Semiconductor Components Industries, LLC, 2013

Publication Order Number:

April, 2013 − Rev. 10

MM5Z2V4T1/D

12 3 4

中文翻译

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