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SZMM5Z3V6T1G PDF预览

SZMM5Z3V6T1G

更新时间: 2024-11-25 11:01:39
品牌 Logo 应用领域
安森美 - ONSEMI 二极管齐纳二极管稳压器
页数 文件大小 规格书
4页 102K
描述
500 mW 标准容差齐纳二极管稳压器

SZMM5Z3V6T1G 数据手册

 浏览型号SZMM5Z3V6T1G的Datasheet PDF文件第2页浏览型号SZMM5Z3V6T1G的Datasheet PDF文件第3页浏览型号SZMM5Z3V6T1G的Datasheet PDF文件第4页 
MM5ZxxxT1G Series,  
SZMM5ZxxxT1G Series  
Zener Voltage Regulators  
300 mW SOD523 Surface Mount  
This series of Zener diodes is packaged in a SOD523 surface  
mount package. They are designed to provide voltage regulation  
protection and are especially attractive in situations where space is at a  
premium. They are well suited for applications such as cellular  
phones, hand held portables, and high density PC boards.  
http://onsemi.com  
SOD523  
CASE 502  
STYLE 1  
Specification Features:  
Standard Zener Breakdown Voltage Range 2.4 V to 75 V  
Steady State Power Rating of 300 mW  
Small Body Outline Dimensions:  
0.047x 0.032(1.20 mm x 0.80 mm)  
1
2
Low Body Height: 0.028(0.7 mm)  
ESD Rating of Class 3 (> 16 kV) per Human Body Model  
Cathode  
Anode  
AECQ101 Qualified and PPAP Capable SZMM5ZxxxT1G  
SZ Prefix for Automotive and Other Applications Requiring Unique  
Site and Control Change Requirements  
These are PbFree Devices*  
MARKING DIAGRAM  
XX M G  
G
2
1
Mechanical Characteristics:  
CASE: Void-free, transfer-molded, thermosetting plastic  
Epoxy Meets UL 94 V0  
LEAD FINISH: 100% Matte Sn (Tin)  
MOUNTING POSITION: Any  
XX = Specific Device Code  
M
= Date Code*  
G
= PbFree Package  
(Note: Microdot may be in either location)  
*Date Code orientation may vary depending  
upon manufacturing location.  
QUALIFIED MAX REFLOW TEMPERATURE: 260°C  
Device Meets MSL 1 Requirements  
ORDERING INFORMATION  
MAXIMUM RATINGS  
Device  
Package  
Shipping  
Rating  
Symbol  
Max  
Unit  
MM5ZxxxxT1G  
SOD523  
(PbFree)  
3,000 /  
Tape & Reel  
Total Device Dissipation FR5 Board,  
P
D
300  
mW  
@ T = 25°C  
A
SZMM5ZxxxT1G SOD523  
(PbFree)  
3,000 /  
Tape & Reel  
Thermal Resistance,  
R
390  
°C/W  
°C  
q
JA  
JunctiontoAmbient (Note 1)  
†For information on tape and reel specifications,  
including part orientation and tape sizes, please  
refer to our Tape and Reel Packaging Specifications  
Brochure, BRD8011/D.  
Junction and Storage  
Temperature Range  
T , T  
J
65 to +150  
stg  
Stresses exceeding Maximum Ratings may damage the device. Maximum  
Ratings are stress ratings only. Functional operation above the Recommended  
Operating Conditions is not implied. Extended exposure to stresses above the  
Recommended Operating Conditions may affect device reliability.  
DEVICE MARKING INFORMATION  
See specific marking information in the device marking  
column of the Electrical Characteristics tables starting on  
page 3 of this data sheet.  
1. EIA/JEDEC51.3 board design and EIA/JEDEC51.2 still air test method  
2
(25 mm , 2 oz., 3.8 mm plating).  
*For additional information on our PbFree strategy and soldering details, please  
download the ON Semiconductor Soldering and Mounting Techniques  
Reference Manual, SOLDERRM/D.  
©
Semiconductor Components Industries, LLC, 2013  
1
Publication Order Number:  
April, 2013 Rev. 10  
MM5Z2V4T1/D  
 

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