SZMM3Z3V9T3G

更新时间： 2024-11-06 11:01:39

品牌	Logo	应用领域
安森美 - ONSEMI		/
页数	文件大小	规格书
6页	64K
描述
200mW 5% Zener, SOD323

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中文翻译

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SZMM3Z3V9T3G 数据手册

MM3Z2V4T1 SERIES

Zener Voltage Regulators

200 mW SOD−323 Surface Mount

This series of Zener diodes is packaged in a SOD−323 surface

mount package that has a power dissipation of 200 mW. They are

designed to provide voltage regulation protection and are especially

attractive in situations where space is at a premium. They are well

suited for applications such as cellular phones, hand held portables,

and high density PC boards.

http://onsemi.com

Specification Features:

Cathode

Anode

• Standard Zener Breakdown Voltage Range − 2.4 V to 75 V

• Steady State Power Rating of 200 mW

• Small Body Outline Dimensions:

0.067″ x 0.049″ (1.7 mm x 1.25 mm)

• Low Body Height: 0.035″ (0.9 mm)

MARKING

DIAGRAM

• Package Weight: 4.507 mg/unit

• ESD Rating of Class 3 (>16 kV) per Human Body Model

• Pb−Free Package is Available

xx M

SOD−323

CASE 477

Mechanical Characteristics:

xx = Specific Device Code

M = Date Code

CASE: Void-free, transfer-molded plastic

FINISH: All external surfaces are corrosion resistant

MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:

260°C for 10 Seconds

ORDERING INFORMATION

LEADS: Plated with Pb−Sn or Sn only (Pb−Free)

POLARITY: Cathode indicated by polarity band

FLAMMABILITY RATING: UL 94 V−0

MOUNTING POSITION: Any

{

Device

Package

Shipping

MM3ZxxxT1

MM3ZxxxT1G

SOD−323

3000/Tape & Reel

SOD−323

(Pb−Free)

MAXIMUM RATINGS

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

Rating

Symbol

Max

Unit

Total Device Dissipation FR−5 Board,

(Note 1) @ T = 25°C

Derate above 25°C

200

1.5

mW/°C

DEVICE MARKING INFORMATION

See specific marking information in the device marking

column of the Electrical Characteristics table on page 3 of

this data sheet.

Thermal Resistance from

Junction to Ambient

635

°C/W

°C

Junction and Storage

Temperature Range

T , T

−65 to

+150

stg

1. FR−4 Minimum Pad

Semiconductor Components Industries, LLC, 2004

Publication Order Number:

April, 2004 − Rev. 6

MM3Z2V4T1/D

12 3 4 5 6

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